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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 36天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15378&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel devices developing for specialty technology. 2. Device Simulation, Test-chip design tape out and measurement system developing. 3. Process flow developing for production. 4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing.
- 面議（經常性薪資達4萬元或以上） 台中市西區 3年工作經驗 2天前更新展開
1. 為客戶提供即時產品設計應用諮詢和技術訊息解說 2. 跨團隊合作，協助相關專案企劃和檢測設備開發 3. 跨團隊合作，協助產品合規管理 4. 產品介紹及推展
就業保險產假產檢假安胎假家庭照顧假 - 面議（經常性薪資達4萬元或以上） 新北市新店區 10年工作經驗 9天前更新展開
1.PCB Layout design : PLACEMENT、ROUTING/SPLIT/MIX PLANE、DRC/GERBER OUT 2.PCB Layout modify : 機電整合與EMC規範 3.PCB Manufacture matter : 設計,製造,組裝各項工程問題回覆暨解決與跨部門溝通 4.PCB Layout evaluation : 評估可行性與PCB尺寸以及相關外包專案事宜 5.專案報告與文件審核輸出，以及相關Layout新零件建立與整合工作 6.團隊管理及成員的能力提升 7.熟Allegro & Pads 等Layout相關軟體 8.其他層峰交辦事項
產假產檢假員工生日禮金年終獎金三節獎金 - 月薪40000元 高雄市大寮區 1年工作經驗 3天前更新展開
需要會倒車。 1.駕駛聯結車安全輸送貨品至指定目的地 2.遵守運輸法規及公司規定執行駕駛作業 3.進行車輛例行檢查和基本維護作業 4.配合完成車輛定期保養與維修 5.確認貨品安全裝載且符合載重規範 6.依調度指示完成貨物裝卸與準點交付 7.詳實記錄運輸日誌及即時匯報異常
員工生日禮金三節獎金意外險員工團保勞保 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 62天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15379&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a member of the IIP (Integrated Interconnect & Packaging) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, Coupe and SoIC process/integration development for customer‘s variety applications. 1. Integration (1) Develop advanced 3DIC (InFO, CoWoS, Coupe and SoIC) process and sustain baseline. (2) Package level reliability, failure mode analysis and improvement plan. (3) Customer technical interface, new tape out and lot handle. (4) Handover developed technologies to manufacturing groups for production. 2. Module Development (1) Be responsible for CVD/PVD/CMP/Lithography/Etch/Polymer/Bonding/Clean module development for 3DIC projects. (2) New technology, materials survey, and process improvement on 3DIC package structures. (3) Process development and tool transfer to mass-production development. 3. Simulation (1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. (2) Practice FEM and DOE in problem solving and path finding particularly on packaging. (3) Continue improvement in simulation methodology, material modeling and script automation.
- 月薪50000元 新竹市東區 工作經歷不拘 14天前更新展開
我們已建造一套垂直加速飛行時間質譜儀(orthogonal acceleration time-of-flight mass spectrometer)的儀器，即放置於國家同步輻射研究中心TLS 05B1，利用同步輻射光源可調光子能量的軟X光，激發生物分子中特定原子的內層電子至特定的分子軌域，同時達到游離及斷鍵的目的。再以飛行時間質譜儀等，分析其分解碎片的質量和其他特性。目前已完成分子束源的建造，一方面進行氣態實驗及表面光譜分析，另一方面，亦進行測試MALDI、氣膠、半球型能量分析儀…等功能。目前正在進行PM2.5反應實驗的設備建設，前來任職者可以學到從無到有的整個過程。此員在訓練後，將擔任TLS 05B1實驗站經理，負責進行實驗設備的操作、實驗、及平日的維護，並進行相關的研究內容。112年開始，也會進行「TPS進行新光束線及實驗站」的規畫及建造。 徵求一博士級研究人員(即俗稱的博士後)，幫忙架設、測試此儀器新增功能，及進行後續的實驗和實驗室及用戶的相關研究。歡迎善於獨立思考、喜歡自己動手做實驗者應徵。
員工生日禮金年終獎金員工團保國內旅遊員工停車位或停車補助 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 62天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15377&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Opening roles for you: 1. Physical Designer 2. Standard Cell Engineer 3. Layout Engineer 4. System and Chip Design Solutions Development 5. FE design & DFT 6. SRAM Engineer 7. Design Flow/Methodology For detailed job description, please refer to: https://careers.tsmc.com/careers/JobDetail?jobId=15377&source=1111&tags=domestic+campus+2025_1111
- 月薪41000~70000元 台南市北區 工作經歷不拘 1天前更新展開
☆薪資待遇 [驗光師保障月薪$47,000三個月] [驗光生保障月薪$45,000三個月] [本科系保障月薪41,000三個月] 消費者驗光、配鏡服務 藥水銷售 眼鏡製作 電腦帳務輸入 日常清潔服務 發展/遠景: 完善的教育訓練制度 培訓為未來店長人才 成就/樂趣:成為有一技在身的專業人士
- 月薪40000元 新北市樹林區 工作經歷不拘 1天前更新展開
1. 高低壓匯流排製作及安裝。 2. 根據技術圖紙，完成電機設備的組裝與安裝。 3. 銅匯流排，加工生產及組裝 4. 無經驗也可
全勤獎金年節獎金年終獎金三節獎金績效獎金 - 面議（經常性薪資達4萬元或以上） 台北市文山區 工作經歷不拘 1天前更新展開
1. 測量控制點每月檢測、維護。 2. 施工圖說套繪檢查細部尺寸、計算、檢核及報備。 3. 測量內業文書處理及執行上級臨時交辦之業務。
三節獎金績效獎金意外險壽險員工團保 - 月薪40000~45000元 台北市南港區 工作經歷不拘 2天前更新展開
1、負責醫師門診及執行醫療業務。 2、協助手術前/後衛教說明。 3、協助使用眼科檢查儀器。 4、薪資=底薪+每月獎金 上班時間：排班制 ◎ 需具護理師執照 ◎ 無眼科經驗可 ◎ 週日固定休診
就業保險產假產檢假家庭照顧假分紅入股 - 面議（經常性薪資達4萬元或以上） 台北市文山區 1年工作經驗 1天前更新展開
1. 執行捷運工程品質管制、進度管控、現場協調等工作。 2. 捷運工程分包商合約管制、圖說、計畫書及計算書送審資料檢視、現場監造作業抽查、 分包商及業主估驗計價。 3. 配合業主稽查及執行上級臨時交辦任務。
三節獎金績效獎金意外險壽險員工團保 - 面議（經常性薪資達4萬元或以上） 台北市文山區 3年工作經驗 1天前更新展開
1. 執行捷運工程品質管制、進度管控、現場協調等工作。 2. 捷運工程分包商合約管制、圖說、計畫書及計算書送審資料檢視、現場監造作業抽查、分包商及業主估驗計價。 3. 配合業主稽查及執行上級臨時交辦任務。
三節獎金績效獎金意外險壽險員工團保 -
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