- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 23天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16580&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Opening roles for you: 1. Global Procurement and Supply Planning Professionals 2. Global Logistics Digital Transformation Engineer 3. Responsible Supply Chain Management Engineer 4. Supply Chain Auditor 5. Resource Recovery Management Engineer For detailed job description, please refer to: https://careers.tsmc.com/careers/JobDetail?jobId=16580&source=1111&tags=AO+2026_1111
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 23天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16579&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Our key responsibilities include: 1. We ensure customers‘ demands are well satisfied in the rapid market, win customer trust, enhance operation efficiency and reach profit maximization. 2. We drive for business effectiveness to bring world changing innovation into reality. 3. Our resources, production and demand planning, pricing, and system integration team develop flexible planning and provide quick responsiveness to coordinate needs between factories and customers. 4. We seek individuals who meet the following criteria: (1) Possess experience in Business, Industrial Engineering, Computer Science, Information Systems, Information Science, or Semiconductor Industry. (2) Have skills in logic thinking and communication, learning agility, and business acumen. Opening roles for you: 1. Account PC Planner 2. Fab Production Control Planner 3. Fab Rationalization Engineer 4. Operation Resources Planning Engineer 5. DevOps Engineer 6. ML/AI Engineer 7. Corporate Planning Associate For detailed job description, please refer to: https://careers.tsmc.com/careers/JobDetail?jobId=16579&source=1111&tags=AO+2026_1111
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 3天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16564&source=1111&tags=AO+2026_1111 因為期待無限可能，所以選擇台積電！ 台積公司致力於營造一個充滿挑戰、持續學習且充滿樂趣的工作環境，並提供高於業界平均水準的薪酬與福利。加入台積電，您將有機會與世界一流的卓越夥伴共事，透過最先進的製程技術，共同成就改變世界的偉大事業。每一項突破與創新，都凝聚了我們的努力與心血。 2026年台積電預辦登積計畫：招募2026年應屆畢業生與研發替代役 台積電誠摯邀請「志同道合」的您，透過「線上應徵」事先註冊履歷。符合資格者將享有優先面試的機會！ 參與2026年預聘暨研發替代役熱門職缺，您將可： ▪ 畢業前即拿到聘書 ▪ 與優秀產業菁英共事 ▪ 在國際舞台盡情發揮 截止收件日：2025/10/31 如您對此計畫感興趣，台積電將前往校園辦理實體行動徵才車活動；活動當天不僅請您喝咖啡，並安排畢業校友與同學們互動交流，機會難得敬請把握機會。校園場次與報名資訊請參考官網（如未報名成功，也歡迎至現場和台積人資互動，現場投遞履歷，還可抽《限量》積星神秘小禮！） 此外，我們為同學準備了四場次不同語系線上說明會(9/19中文、10/3日文、10/8中文、10/22英文)，歡迎報名參加，以掌握台積電的趨勢、組織概況與求職撇步！報名連結清參考官網（採線上報名，報名成功後將由台積電招募團隊審核，並透過系統自動發送e-mail通知，可重複報名不同場次聆聽） 建議您根據學習領域與專業，投遞申請以下2~4個職位。符合主管需求者，將會收到面談邀請通知。 ▋歡迎志同道合的你，一起加入台積電 ▋世界上的每一個夢，都由我們來圓夢 Because we believe in endless possibilities, we choose TSMC! TSMC offers a wide variety of fulfilling experience and opportunities across our organization in many different locations. By joining TSMC, you will work with the high-performing teams in the industry and achieve your full potential through a comprehensive and systemized learning program here. We are devoted to achieving technology advancement, pursuing manufacturing excellence, and optimizing customer service. 2026 TSMC Advanced Offer and R&D Substitute Service Program Welcome to submit your resume via our application systems and apply to the following vacancies : 2026 TSMC Advanced Offer(AO) and R&D Substitute Service Program (RDSS). You will then be able to: • Get the offer before graduation. • Work with professional experts in the industry. • Fulfill yourself on the world stage. Application Deadline: October 31, 2025 Attending Campus Recruitment events with TSMC to enjoy a coffee with the industry experts to find out what suit you the best. For campus event schedule and registration details, please refer to TSMC career website (even if you are unable to register successfully, feel free to visit our booth and have a chat with us.) Submit your resume now, and gain a chance to win a limited TSMC’s gift! We’re also organizing a series of 〝TSMC Campus Recruitment Online Briefing Session〝, where you can find out more about industry trend, career opportunities, and life at TSMC. The sessions will be held on Sep. 19, Oct. 4, Oct. 8, and Oct. 16 respectively. Registration link: Please refer to the career website *TSMC Talent Acquisition Team will send a confirmation email to the eligible applicants who have successfully registered to the events. We recommend you applying for two to four positions based on your academic background and professional expertise. If your qualifications meet the position requirements, you will receive an invitation for interviews. ▋Join TSMC｜Together, We Grow ! 2026 TSMC AO&RDSS Recruitment Job (Please refer to the job in the career website for the details for each job below): R&D (研究與發展組織) 1-1 Research and Development Engineer (R&D) 1-2 Design and Technology Platform Engineer (DTP) 1-3 Specialty Engineer (Specialty) 1-4 Integrated Interconnect & Packaging Engineer (IIP) Operations (營運組織) 2-1 Process Integration Engineer (PIE) 2-2 Process Engineer (PE) 2-3 Equipment Engineer (EQ) 2-4 Intelligent Manufacturing Engineer (IMC/MFG) 2-5 Facility Engineer (FAC) 2-6 Product Engineer (PE) 2-7 Advanced Packaging Technology and Service Engineer (APTS) 2-8 Quality & Reliability Engineer (Q&R) 2-9 Module Associate Engineer (MAE) Corporate Business (策略暨支援組織) 3-1 Information Technology Engineer (IT) 3-2 Corporate Planning Organization (CPO) 3-3 Materials Management Engineer (MM) 3-4 Human Resources Specialist (HR) 【履歷填寫重點提醒】 1. 請務必優先填寫完成「畢業學校、畢業年份、就讀科系」後再更新履歷細節資訊，在系統資料送出後，您仍可以在收到面試邀請前持續更新內文。 2. 請詳細填寫履歷資料，包括學歷、專業關鍵字及自傳等內容；若您非外籍人士，除專業關鍵字外，其他欄位請以全中文填寫即可。 3. 自傳與專業關鍵字欄位有字數限制(1000字)，請確認字數是否符合要求，以免導致網頁無法成功送出。 4. 若履歷欄位為下拉式選單，當找不到合適內容時，可點選「其他」手動資料送出。 更多2026預聘暨研發替代役招募活動，請密切關注台積電FB粉絲專頁@加入台積 共創奇蹟 【Notes for Resume Submission】 1. Please prioritize completing the 〝Graduation School, graduation year and major〝 sections when submitting your resume. You can continue to update the content before receiving an interview invitation after the system data has been submitted. 2. Please click “Apply” and provide detailed resume information, including your education level, profession (with keywords that best describe your domain expertise) and autobiography, etc. If you are not a foreigner, please fill out the form (except for the keywords) in Mandarin. 3. Please make sure that the total work counts of your autobiography and keywords (domain description) are within a maximum of 1,000 characters respectively to prevent technical issues. 4. If a resume field is presented as a dropdown menu and you cannot find a suitable option, you may select 〝Other〝 and manually submit the required information. For more information about the 2026 Advanced Offer (AO) and R&D Substitute Service Program (RDSS), please follow our TSMC Facebook fan page@加入台積 共創奇蹟
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 23天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16565&source=1111&tags=AO+2026_1111 Description : R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 23天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16566&source=1111&tags=AO+2026_1111 Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development productivity/quality.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 23天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16567&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel devices developing for specialty technology. 2. Device Simulation, Test-chip design tape out and measurement system developing. 3. Process flow developing for production. 4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 23天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16568&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a member of the IIP (Integrated Interconnect & Packaging) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, Coupe and SoIC process/integration development for customer‘s variety applications. 1. Integration (1) Develop advanced 3DIC (InFO, CoWoS, Coupe and SoIC) process and sustain baseline. (2) Package level reliability, failure mode analysis and improvement plan. (3) Customer technical interface, new tape out and lot handle. (4) Handover developed technologies to manufacturing groups for production. 2. Module Development (1) Be responsible for CVD/PVD/CMP/Lithography/Etch/Polymer/Bonding/Clean module development for 3DIC projects. (2) New technology, materials survey, and process improvement on 3DIC package structures. (3) Process development and tool transfer to mass-production development. 3. Simulation (1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. (2) Practice FEM and DOE in problem solving and path finding particularly on packaging. (3) Continue improvement in simulation methodology, material modeling and script automation.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 23天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16570&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們確保晶片的品質、持續提升良率，提供給客戶具有競爭力且高品質的晶片，讓電子產品不但先進且效能穩定；製程整合工程師為半導體製造中的重要協調者，需要與客戶溝通了解客製化的晶片應用需求，再將訊息帶回廠內，與各工程單位合作。良率精進工程師監控晶片的良率與缺陷，使用量測機台監測晶片的缺陷，找出可能的問題，再與製程解決問題。 1. A highly motivated individuals with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 23天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16571&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們在第一線負責晶片製造過程，改善機台製程參數的設定，提升良率並讓機台每單位時間產出增加，也降低生產成本；半導體製程可大致分為四大模組，大致流程順序為薄膜沈積、黃光微影製程、溼式與乾式蝕刻、熱製程與離子摻雜(擴散)。 1. To be responsible to drive leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices in order to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 23天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16572&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 機台是工廠穩定運作的基礎，我們在生產線上，負責高端精密、高單價半導體設備的維護、保養並判斷、解決機台發生的問題；如此可減少機台當機的時間與提升機台可運轉的時間，進而降低生產成本並提升公司的獲利能力。 1. Master Nano Diffusion, Thin Film, Lithography, Etching, or Metrology equipment. 2. Sustain and troubleshoot issues with high-tech equipment. 3. Improve and enhance the efficiency and productivity of equipment. 4. Plan and execute the analysis or defect detection projects. 5. Communicate with cross-functional engineers or vendors.
- 月薪33900元 高雄市楠梓區 工作經歷不拘 4天前更新展開
1.既有廠區損害防阻強化改善推動與執行成效確認 2.新建廠房損防設置標準檢討與制定 3.廠房設置安全驗收(SRR)執行與不符改善追蹤確保 4.保險經紀人/公司對應及相關專案推動及執行 5.廠設安全國內外法規鑑別與標準化 6.客戶稽核損防議題對應 7.其他主管交辦事項
分紅入股年終獎金三節獎金禮品意外險 - 月薪30000~33000元 新竹市 工作經歷不拘 3天前更新展開
我們正在尋找一位主動、細心、願意學習的行政助理，協助總經理處理日常行政事項與部門間協調工作，適合對辦公室運作、組織管理有興趣的新鮮人！ 你會負責： 協助安排部門會議、整理報告資料、彙整簡報內容 支援總經理交辦之日常行政與跨部門溝通協調事項 追蹤任務進度與日程，協助會議前後的準備與紀錄整理 觀察與學習組織內部行政作業、管理流程與決策邏輯 【加分但非必須】處理簡單資料彙整、表格編輯與文件排版 【你會學到】 行政流程規劃與組織技巧 與主管、高層互動與簡報溝通能力 如何整理資訊、編輯報告與做簡報 管理思維與跨部門協作流程 【加值技能】表單管理、Excel/PPT 等工具應用 【我們期待你】 對辦公室行政與溝通協調有興趣 細心、有責任感，能準時完成交辦事項 願意學習新工具與新任務 熟基本文書工具（Word / Excel / PowerPoint） 新鮮人可！如果你願意從零開始、我們願意培養你
產假年終獎金員工團保誤餐費員工餐廳 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 23天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16573&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 智慧製造工程師為創造晶圓產出最大化，滿足客戶交期，為公司帶來營收；身為工廠的第一線管理者，需掌握生產流程，藉由良好且精準派工提升機台生產效率，帶領技術員團隊確保製造流程順暢運行並達成每日的產能目標。 As a global semiconductor technology leader, TSMC is seeking an Intelligent Manufacturing Engineer to join our team. Our commitment to driving manufacturing excellence has led us to integrate artificial intelligence, machine learning, expert systems, and advanced algorithms to build up an intelligent manufacturing environment. Join TSMC, we are the most advanced technology team and connect with the world, as we head towards an unlimited future. We look forward to you joining us! You will be assigned to one of the following five roles according to your interest, experiences, and technical background. Responsibilities: 1. MFG Intelligent Manufacturing Engineer 2. CIM Intelligent Manufacturing Engineer 3. Data Analyst & Data Scientist 4. AMHS (Automated Material Handling System) Engineer 5. PIDS/WAT (Wafer Acceptance Test) Engineer 6. PIDS/NTO (New TapeOut) Engineer 7. Quality Management Engineer
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 23天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16574&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 廠務工程師為整合各項廠區資源，提供晶圓生產所需之電力、水、氣體、化學品、空調等，為台積高度智慧自動的生產單位，供應最高品質、最穩定的生產作業環境。近年廠務工程師更肩負環境保護與永續的責任，如何精進節水、節能、減碳、環保的廠務運轉技術，更是廠務工程師可以發揮專業與創意的主舞台。 1. Responsible for the planning, constructing, operating, and maintaining semiconductor plant facility systems, including risk analysis of facility system operations and supply quality, allocating resources and energy, managing construction safety. 2. Provide a stable facility system, including power, water, gas, chemicals and HVAC, to meet wafer production requirements. 3. Collaborate with other departments to ensure that the facility system is operating at the highest level of quality when on duty. 4. Construction management & project coordination.
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