- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 1天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19037&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們確保晶片的品質、持續提升良率，提供給客戶具有競爭力且高品質的晶片，讓電子產品不但先進且效能穩定；製程整合工程師為半導體製造中的重要協調者，需要與客戶溝通了解客製化的晶片應用需求，再將訊息帶回廠內，與各工程單位合作。良率精進工程師監控晶片的良率與缺陷，使用量測機台監測晶片的缺陷，找出可能的問題，再與製程解決問題。 1. A highly motivated individual with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, troubleshooting equipment and mentoring technicians. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 1天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19036&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a member of the IIP (Integrated Interconnect & Packaging) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, Coupe and SoIC process/integration development for customer‘s variety applications. 1. Integration (1) Develop advanced 3DIC (InFO, CoWoS, Coupe and SoIC) processes and sustain baseline. (2) Package level reliability, failure mode analysis and improvement plan. (3) Customer technical interface, new tape out and lot handle. (4) Handover developed technologies to manufacturing groups for production. 2. Module Development (1) Be responsible for CVD/PVD/CMP/Lithography/Etch/Polymer/Bonding/Clean module development for 3DIC projects. (2) New technology, materials survey, and process improvement on 3DIC package structures. (3) Process development and tool transfer to mass-production development. 3. Simulation (1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. (2) Practice FEM and DOE in problem solving and path finding particularly on packaging. (3) Continue improvement in simulation methodology, material modeling and script automation. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 1天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19035&source=1111&tags=Domestic+Campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel devices developing for specialty technology. 2. Device Simulation, Test-chip design tape out and measurement system developing. 3. Process flow developing for production. 4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 1天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19034&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development productivity/quality. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 1天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19033&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 1天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19032&source=1111&tags=domestic+campus+2026_1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2024年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術，為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 因為期待無限可能，所以選擇台積。 台積致力於營造具挑戰性、可以持續學習而又有樂趣的工作環境，提供同業平均水準以上的薪酬與福利。 加入台積，您將與世界一流的優秀夥伴共事，透過最先進的製程技術，成就改變世界的大事，所有突破與創新，都有一份我們的努力。 歡迎「志同道合」的你，透過本計畫提前完成〝〝線上應徵〝〝註冊履歷，符合資格者，將享有優先面試的機會唷！ 如您對台積電2026校園徵才計畫感興趣，歡迎報名參加，以掌握台積趨勢、組織概況與求職撇步。 此外，我們特別為同學安排了校園徵才實體與線上說明會，歡迎踴躍報名參加，以便了解公司市場趨勢、組織概況，並掌握求職技巧！ 報名連結：請參考官網連結 (採線上報名，報名成功後將由系統自動發送活動通知信件，可重複報名不同場次。) 請線上應徵此「校園徵才活動」，如您已有求職偏好職缺，再根據以下職位額外投遞2至4個職位。 ▋歡迎志同道合的夥伴，一起加入台積 ▋世界上的每一個夢，都由我們來圓夢 Join TSMC: Where Infinite Possibilities Await. At TSMC, we believe in creating a challenging, continuous learning, and enjoyable work environment. We offer competitive compensation and benefits that exceed industry averages. Join us, and you‘ll collaborate with world-class talent, leveraging the most advanced process technologies to achieve breakthroughs that change the world. Every innovation and advancement carry the mark of our dedication. Are you ready to make an impact? We invite like-minded individuals to pre-register and submit resumes online through the 2026 Campus Recruitment Program. Qualified applicants will receive priority interview opportunities! We are organizing both on-campus recruitment and online information sessions. We encourage you to sign up for the upcoming events to gain insights into the market trends, organizational overview, and master essential interview skills. Registration Link: Click Here (Pre-registration is required – After registration, you will receive an email notification sent by the system afterwards. You may register for multiple sessions.) Please apply online for this Campus Recruitment Event. If you already have preferred job openings, you may additionally apply for 2 to 4 positions from the list below on career site. 2026 台積電校園熱門職缺 TSMC Campus Recruitment Hot Jobs : R&D (研究與發展組織) 1-1 Research and Development Engineer (R&D) 1-2 Design and Technology Platform Engineer (DTP) 1-3 Specialty Engineer (Specialty) 1-4 Integrated Interconnect and Packaging Engineer (IIP) Operations (營運組織) 2-1 Process Integration Engineer (PIE) 2-2 Process Engineer (PE) 2-3 Equipment Engineer (EQ) 2-4 Intelligent Manufacturing Engineer (IMC/MFG) 2-5 Facility Engineer (FAC) 2-6 Product Engineer (PE) 2-7 Advanced Packaging Technology & Service Engineer (APTS) 2-8 Quality & Reliability Engineer (Q&R) 2-9 Module Associate Engineer (MAE) 儲備模組副工程師 2-10 Technician 技術員 Corporate Business (策略暨支援組織) 3-1 Information Technology (IT) 3-2 Corporate Planning Organization (CPO) 3-3 Materials Management (MM) 3-4 Human Resources (HR) 3-5 Finance, Accounting and Risk Management (FIN) 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
- 月薪45000~60000元 桃園市平鎮區 3年工作經驗 1天前更新展開
1.公用設備運轉維護 2.廠房設施維護 3.塗佈機/分條機台維護保養 4.基本電腦操作(簡單文書作業) 5.無塵室環境維護
國內旅遊國外旅遊員工聚餐慶生會尾牙 - 面議（經常性薪資達4萬元或以上） 東南亞新加坡 工作經歷不拘 1天前更新展開
Ever wondered what powers your phone, laptop, or even your future? We’re UMC, and our team from Singapore is excited to meet you at our Taiwan Campus Career Talk and Career Fair! Hear directly from our Singapore-based engineer about building a rewarding career through mentorship, hands-on learning, and the latest semiconductor technology. Discover how integrated circuits and wafers are made, and get an insider’s look at advanced manufacturing. Whether you’re new to tech or planning your next move, this is your chance to see how UMC empowers employees to grow in one of the world’s most impactful industries. Explore exciting career opportunities in Singapore—a global hub for innovation and technology. Bring your curiosity and questions—take the first step toward engineering your future with UMC in Singapore! Take the first step toward precision-engineering your future. ★Opening Vacancies: (1) Process Engineer (2) Equipment Engineer (3) Process Integration Engineer (4) Facilities Engineer (5) Technology Development Engineer (6) Manufacturing Engineer ★ 2026 Campus Career Talk and Career Fair Timetable: 3/6 陽交大企業說明會 (12：20-13：10) 3/7 台大博覽會 (09：30-16：30) 3/9 台大企業說明會 (15：40-16：40) 3/10 北科企業說明會 (16：10-17：00) 3/12 成大企業說明會 (20：00-20：50) 3/14 陽交大博覽會 (10：00-16：00) 3/15 成大博覽會 (10：00-15：00) 3/17 台科企業說明會 (15：30-16：20) 3/18 清大企業說明會 (18：00-18：50) 3/19 北科博覽會 (11：00-16：00) 3/21 清大博覽會 (10：00-16：00) 3/22 中央博覽會 (09：30-15：30)
產假分紅入股員工生日禮金員工退休規劃（包括退休金及退休後之福利等）員工及眷屬喪葬補助 - 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 1天前更新展開
[研發工程師]半導體技術研發、製程技術研發、智財開發(IP Development) [製程整合工程師]半導體製程整合、推動量產產品良率改良及持續製程最佳化 [製程工程師]半導體製程品質改善及維護 [智慧製造/資訊工程師]數據平台系統及資料工程、深度學習建模與開發、物聯網系統整合、IT整合、應用軟體開發及整合 及其他半導體相關工作
產假分紅入股員工生日禮金員工退休規劃（包括退休金及退休後之福利等）員工及眷屬喪葬補助 - 面議（經常性薪資達4萬元或以上） 東北亞日本 工作經歷不拘 1天前更新展開
QA roles in In process quality assurance or Incoming Quality assurance Responsible in QA functions and to maintain Quality Management System (QMS), 1. Process control : 1.1 Statistic process control/Process change management / FMEA / Control Plan review to ensure all case are fulfill UMC QA or international standard requirement; 1.2 System and procedure enhancement 2. IQA : manage process raw material quality and supplier management for production stability. 2.1 incoming material non-conformance handling 2.2 new material /supplier qualification 2.3 Supplier management: audit, rating, improvement etc. 2.4 systems maintain 3. Participate in project for productivity, daily job & work process improvement & quality system enhancement
產假分紅入股員工生日禮金員工退休規劃（包括退休金及退休後之福利等）員工及眷屬喪葬補助 - 面議（經常性薪資達4萬元或以上） 台南市新市區 1年工作經驗 1天前更新展開
1.先進元件設計及開發 2.先進元件特性開發 3.電腦輔助元件設計 4.Testkey 設計及分析 5.先進元件設計與開發 6.元件電性分析 7.利用先進製程增進元件特性 8.Test Key 設計及分析
產假分紅入股員工生日禮金員工退休規劃（包括退休金及退休後之福利等）員工及眷屬喪葬補助 - 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 1天前更新展開
1.主被動光學元件，如調變器、檢測器、光波導、耦合器等之設計、模擬與優化。 2.執行矽光子元件及系統級的電性測試的量測，包括光學特性(如插入損耗、反射、頻寬等)與電性測試，並支援光電協同驗證相關量測。 3.分析量測數據，撰寫報告並提出設計優化建議。 4.協助製程團隊進行元件製作流程規劃，並針對製程結果進行設計修正。 5.與跨部門團隊合作，推動產品開發進度，解決技術問題。 6.使用相關軟體 (如Lumerical、COMSOL、Synopsys等)進行光學與電學模擬分析。
產假分紅入股員工生日禮金員工退休規劃（包括退休金及退休後之福利等）員工及眷屬喪葬補助 - 面議（經常性薪資達4萬元或以上） 新竹市東區 3年工作經驗 1天前更新展開
1.主被動光學元件，如調變器、檢測器、光波導、耦合器等之設計、模擬與優化。 2.執行矽光子元件及系統級的電性測試的量測，包括光學特性(如插入損耗、反射、頻寬等)與電性測試，並支援光電協同驗證相關量測。 3.分析量測數據，撰寫報告並提出設計優化建議。 4.協助製程團隊進行元件製作流程規劃，並針對製程結果進行設計修正。 5.與跨部門團隊合作，推動產品開發進度，解決技術問題。 6.評估PIC (光子積體電路)系統所需的IC元件，包括Driver、TIA、控制IC，以及用於晶片與光學元件的支援電路。 7.封裝設計與整合，包括光學結構及電/光互連設計、熱管理、製程整合，及可製造性等相關考量 8.使用相關軟體 (如Lumerical、COMSOL、Synopsys等)進行光學與電學模擬分析。
產假分紅入股員工生日禮金員工退休規劃（包括退休金及退休後之福利等）員工及眷屬喪葬補助 - 面議（經常性薪資達4萬元或以上） 東北亞日本 工作經歷不拘 1天前更新展開
1.機台與設備的日常保養與維護 2.機台與設備的故障排除 3.維持產線的正常運轉 * 聯華電子股份有限公司(UMC)與United Semiconductor Japan Co., Ltd. (USJC)為關係企業，本職缺係為USJC所設，候選人錄取後將先與UMC簽約，於台灣完成專業訓練並取得日本工作簽證後，後續依集團計畫安排與USJC簽約並轉任日本三重工作。
產假分紅入股員工生日禮金員工退休規劃（包括退休金及退休後之福利等）員工及眷屬喪葬補助 -
