1. Package related structure stress analysis including warpage, material study.
2. Package and board level stress modeling for TCT, drop and vibration.
3. IC and package thermal analysis, modeling and characterization
4. Chip-Package-PCB thermal co-simulation and design.
5. System level thermal simulation 6. System level stress simulation
• System/Architecture design for 4G/5G communication systems
• Baseband algorithm design
• DSP embedded system coding/performance optimization
• System performance verification