- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 1天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15380&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Job Role: 1. Highly motivated veteran and new talents to join force research and pathfinding in Advanced packaging and system integration technologies for both extending Moore‘s Law and in post-Moore era. 2. Long prospective career path in semiconductor technologies looking at more Moore‘s and beyond Moore‘s Law Eco-industry. Responsibilities: 1. Integration engineering for process integration and device/system level modeling, including electrical, thermal, and mechanical modeling. 2. Module engineering in advanced FEOL/MEOL/BEOL wafer process modules, and in advanced system packaging, including wafer level fan-out, interposers, and 3D chip stacking. 3. Silicon photonics expertise in the following areas: optical components design (lens, modulator, detector, waveguide w/ various materials), photonic circuits design (w/ focus on optical communication), and computer system architect (w/ focus on parallel processing and high-speed networking).
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 1天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15378&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel devices developing for specialty technology. 2. Device Simulation, Test-chip design tape out and measurement system developing. 3. Process flow developing for production. 4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 1天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15379&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a member of the IIP (Integrated Interconnect & Packaging) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, Coupe and SoIC process/integration development for customer‘s variety applications. 1. Integration (1) Develop advanced 3DIC (InFO, CoWoS, Coupe and SoIC) process and sustain baseline. (2) Package level reliability, failure mode analysis and improvement plan. (3) Customer technical interface, new tape out and lot handle. (4) Handover developed technologies to manufacturing groups for production. 2. Module Development (1) Be responsible for CVD/PVD/CMP/Lithography/Etch/Polymer/Bonding/Clean module development for 3DIC projects. (2) New technology, materials survey, and process improvement on 3DIC package structures. (3) Process development and tool transfer to mass-production development. 3. Simulation (1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. (2) Practice FEM and DOE in problem solving and path finding particularly on packaging. (3) Continue improvement in simulation methodology, material modeling and script automation.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 1天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15377&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Opening roles for you: 1. Physical Designer 2. Standard Cell Engineer 3. Layout Engineer 4. System and Chip Design Solutions Development 5. FE design & DFT 6. SRAM Engineer 7. Design Flow/Methodology For detailed job description, please refer to: https://careers.tsmc.com/careers/JobDetail?jobId=15377&source=1111&tags=domestic+campus+2025_1111
- 月薪35000~44000元 新竹市東區 工作經歷不拘 3天前更新展開
實習地點：竹科、南科 實習職務：研發/製程/製程整合/智慧製造/資訊/數據分析等 實習期間：2025/7/7-2025/8/31 歡迎大四升碩一(預碩生)、碩班、博班在學學生投遞履歷
產假分紅入股員工生日禮金年終獎金三節獎金 - 月薪35000~44000元 東南亞新加坡 工作經歷不拘 3天前更新展開
實習地點：新加坡 實習職務：研發/製程/製程整合 實習期間：2025/7/1-2025/8/28 歡迎大四升碩一、碩班、博班在學學生投遞履歷
產假分紅入股員工生日禮金年終獎金三節獎金 - 面議（經常性薪資達4萬元或以上） 台南市新市區 5年工作經驗 3天前更新展開
1.運用製程設備專業知識及統計分析手法針對工廠設備相關資料(FDC,Inline monitor..)加以解析，進而達到降低機台異常，改善機台能力，增加工廠生產效率 2.成本降低 3.異常問題解析 4.專案領導及協調 5.當責性 6.創新分析方法
產假分紅入股員工生日禮金年終獎金三節獎金 - 面議（經常性薪資達4萬元或以上） 台南市新市區 3年工作經驗 3天前更新展開
1.製程開發執行, 新技術開發之時程掌控，以符合製程整合新製程開發之需求，提高客戶之滿意度 2.開發模組製程, 使先進製程良率達到量產需求 3.維持製程穩定度, 降低製程缺陷數目及提高機台妥善率 4.線上異常處理及後續成效追蹤 5.建立標準規範(SOP)，改善現行系統漏洞 6.突破性製程研發改善，提高公司競爭力
產假分紅入股員工生日禮金年終獎金三節獎金 - 月薪35000元 新竹市東區 工作經歷不拘 3天前更新展開
聘僱期間：約至2026年2月底 策劃與執行健康中心各項醫療救護衛生業務，以增進同仁健康。 執行健康中心各項行政業務 執行醫療救護衛生工作—1. 員工傷病評估.急救及照護 執行醫療救護衛生工作—2. 緊急應變救護及訓練 執行醫療救護衛生工作—3. 員工一般疾病護理 計劃與執行健康促進活動 健康管理—健康檢查.複檢.追蹤管理等 場內緊急救護及應變演練 依據職安法相關執行相關健康促進及安委會報告
產假分紅入股員工生日禮金年終獎金三節獎金 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 1天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15376&source=1111&tags=domestic+campus+2025_1111 Responsibilities: R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations.
- 面議（經常性薪資達4萬元或以上） 新竹市東區 3年工作經驗 今天剛更新展開
•協助處理銷售營運管理部門相關業務 •研究分析針對銷售營運相關的資料如營收,forecast,市佔率,銷售業績達成率等 •整合多元化市場資料，針對主要客戶終端產品應用市場發展的走向，進行相關分析，预测業績成長的趨勢 •協調各單位如業務，工廠及系统部門導入新客戶資料，並進行整理及維護 •研讀市場報告以及公司內部資料,研擬分析公司的競爭力 •與系統團隊合作建立自動化報表和模板用以分析市場以及營收相關報告 •支援業務主管單位之特定專案以協助管理層制定決策
就業保險產假產檢假分紅入股年終獎金 - 月薪37000~55000元 台中市后里區 工作經歷不拘 今天剛更新展開
1.依本身受訓技能，承接工作項目要求之執行，以符合作業標準。 2.現場6S(整理、整頓、清潔、清掃、教養、安全)之執行，以確保生產作業流程順暢。 3.反應與處理異常狀況，以確保生產作業供料順暢。 4.接受員工教育訓練，以符合作業需求。
三節獎金績效獎金員工及眷屬住院慰問金上下班交通車員工健身房 - 月薪30000~45000元 台中市后里區 工作經歷不拘 今天剛更新展開
1.依本身受訓技能，承接工作項目要求之執行，以符合作業標準。 2.現場6S(整理、整頓、清潔、清掃、教養、安全)之執行，以確保生產作業流程順暢。 3.反應與處理異常狀況，以確保生產作業供料順暢。 4.接受員工教育訓練，以符合作業需求。
三節獎金績效獎金員工及眷屬住院慰問金上下班交通車員工健身房 - 月薪32000元 台中市梧棲區 工作經歷不拘 3天前更新展開
1.依規劃實施排程及交期確認 2.交期異常反應.更新及確認 3.協助流程卡印製及發行 4.生產變更 5.上班時間08:30~17:30
員工生日禮金年終獎金員工團保員工餐廳國內旅遊 -
