• 面議(經常性薪資達4萬元或以上) 新竹市東區 8年工作經驗 37天前更新
    1. Familiar with HSIO spec (PCIE, USB, UFS, DP, ...etc) and system usage scenario 2. Familiar with Windows and Android OS 3. Experienced with PC south bridge design 4. Experienced with PC USB host chipset design
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  • 面議(經常性薪資達4萬元或以上) 新竹市東區 2年工作經驗 37天前更新
    1. CPU system design and performance analysis 2. System bus architecture and integration 3. IP and system verification 4. Debug Architecture related IP design and integration
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  • 面議(經常性薪資達4萬元或以上) 新竹市東區 8年工作經驗 37天前更新
    Role Overview: Join the Tier-1 PC OEM team as a key driver of revenue growth and market expansion. You will not only manage long-term relationships with Tier-1 PC OEMs but also act as a demand creator, securing strategic design wins and ensuring MediaTek solutions are integrated into next-generation products. Key Responsibilities: • Drive Design Wins: Act as a proactive demand creator to secure strategic design wins and RFQs. Lead the design-in and RFQ process by engaging customers early in their development cycle and ensuring adoption of MediaTek solutions. • Account Management & Growth: Manage and prospect long-term business relationships with Tier-1 PC OEMs to achieve and exceed revenue goals. • Data Analysis & Executive Reporting: Analyze sales performance, pipeline metrics, and market data to create high-quality reports. Prepare and present regular business reviews and strategic insights for internal leadership. • CRM & Pipeline Management: Maintain accurate and up-to-date records in Salesforce. Ensure rigorous management of opportunities, account details, and forecast data to provide clear visibility into the sales pipeline. • Sales Operations Execution: Facilitate customer forecasting and oversee end-to-end sales operations, including communications with ODM, supply chain and hub service counterparts, shipment notifications, execution planning, rebate and legal documentation, and RMA processes. • Market Intelligence: Actively monitor customer growth, market movements, and trends within the PC/NB industries. Gain solid understanding of competitor activities and benchmarking to refine sales strategies. • Product Advocacy: Influence customers and internal stakeholders by clearly articulating the differentiation and value proposition of MediaTek-based products. • Cross-Functional Collaboration: Serve as the primary liaison between external partners and internal cross-functional teams to ensure seamless delivery and customer satisfaction.
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  • 面議(經常性薪資達4萬元或以上) 新竹市東區 4年工作經驗 37天前更新
    1. Responsible for high-speed UCIE development, including architecture definition, verification, and customer support (familiar with architecture, firmware, debugging, optimization, and testing tasks). 2. Define architecture and specifications through simulations. ( Matlab ) 3. Develop test automation. 4. Collaborate with the team to establish system prototypes and optimize performance. 5. Achieve product integration for clients and support mass production.
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  • 面議(經常性薪資達4萬元或以上) 新竹縣竹北市 工作經歷不拘 66天前更新
    1. 無線網通系統, 數位設計 2. Micro Processor, 系統架構, low power/效能分析 3. SOC 整合/驗證 4. 工作地點:竹北/台北
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  • 面議(經常性薪資達4萬元或以上) 台北市內湖區 工作經歷不拘 37天前更新
    韌體應用團隊負責支援 MediaTek 顯示器專案中的 Scaler SoC。 主要職責包括: 1. 協助客戶實現顯示器功能與相關應用 2. 釐清或除錯客戶專案中的問題 3. 於客戶端現場與客戶協同進行專案開發
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  • 面議(經常性薪資達4萬元或以上) 新竹市東區 6年工作經驗 128天前更新
    1. Burn in process flow set up & qualification plan​ 2. Qualification failure electrical & physical analysis​ 3. Product reliability concern engagement with customer​ 4. New test supplier audit & qualification​ 5. Testing house supplier quality & reliability management (Quality incident handling, PCN, regular audit, score card, etc.)​ 6. New product/technology introduction quality & reliability management​ 7. Testing house supplier quality improvement project
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  • 面議(經常性薪資達4萬元或以上) 新竹縣竹北市 4年工作經驗 128天前更新
    晶圓採購 & 成本控管 & 資訊整合 1.產能規劃&分配 2.詢價 談價 年度成本預測 3.主導晶圓廠相關會議 與內部事業部溝通會議 4.採購與成本相關專案管理
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  • 面議(經常性薪資達4萬元或以上) 新竹縣竹北市 工作經歷不拘 99天前更新
    1. IC 功能驗證 2. IC 韌體撰寫(C語言) 3. 協助 CSA(Customer SA) / 客戶解決問題
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  • 面議(經常性薪資達4萬元或以上) 新竹市東區 8年工作經驗 37天前更新
    1. Expertise in managing critical IP technologies for HPC, such as high-speed interface, SerDes, D2D, 2.5D/3D, HBM, and advanced node process technologies, with a strong understanding of market dynamics 2. Investigate and analyze critical IP technology roadmaps, market trends and critical IP licensors business analysis as a basis to IP sourcing strategy forming 3. Mastering the decision-making groups, processes, key persons and underlying information circulated within major IP licensors, and driving substantial influence on their roadmap planning following corporate strategy 4. Leadership in collaborating with external partners, internal product marketing, internal engineers, business, financial and legal teams to proceed with on-target business negotiation and quality contract process management 1. 精於管理高效能運算(HPC)中的關鍵IP技術 (例如高速介面、SerDes、D2D、2.5D/3D、HBM等技術) 及先進製程相關技術、以及相關產業發展動態。 2. 調查並分析關鍵IP技術藍圖/市場趨勢,以及關鍵IP授權廠商之商務分析,作為制定IP採購策略的依據。 3. 掌握主要IP授權廠商之決策組織、流程、關鍵人員及資訊,配合公司策略,具體引導其相關藍圖規劃 4. 領導外部夥伴、內部產品行銷、內部工程、業務、財務及法務團隊的合作,完成符合技術合作目標之商務談判及合約管理
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  • 面議(經常性薪資達4萬元或以上) 新竹市東區 8年工作經驗 37天前更新
    1. 5G modem 架與數位電路設計 2. CLK, 測試, Reset相關設計與規劃 3. 低功耗設計 4. 系統整合 RTL 到 Gate level, 含STA
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  • 面議(經常性薪資達4萬元或以上) 新竹市東區 工作經歷不拘 37天前更新
    Design the 5G and next-generation modem processor with cost effective, high speed, and low power hardware performance. This position will develop the modem processor that optimized for modem system. Co-work closely with software and system architecture colleague to analysis the sweet point of system performance and low power. In this position, you will push the physical performance to next level and co-work with place-and-route (PAR) team resolving the bottleneck of speed and power.
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  • 面議(經常性薪資達4萬元或以上) 新竹市東區 4年工作經驗 37天前更新
    1. 與業務使用者進行需求訪談與流程討論 2. IT 相關服務的專案管理 3. 公司商務領域的數位化(應用系統、人工智慧、數據)轉型 1. Engagement and Process Discussion with Business Users. (FIN domain) 2. Project Management on IT Service 3. Digitalization (application, AI, data) Transformation for business domain
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  • 面議(經常性薪資達4萬元或以上) 新竹市東區 8年工作經驗 37天前更新
    1. IC封裝/晶圓凸塊技術開發與管理 2. 與封裝廠合作完成規劃之技術開發 3. 先進封裝技術開發,品質驗證與生產良率管理 4. 定期與不定期執行bumping/fan-out/WLCSP廠品質稽核
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