• 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 6天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16573&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 智慧製造工程師為創造晶圓產出最大化,滿足客戶交期,為公司帶來營收;身為工廠的第一線管理者,需掌握生產流程,藉由良好且精準派工提升機台生產效率,帶領技術員團隊確保製造流程順暢運行並達成每日的產能目標。 As a global semiconductor technology leader, TSMC is seeking an Intelligent Manufacturing Engineer to join our team. Our commitment to driving manufacturing excellence has led us to integrate artificial intelligence, machine learning, expert systems, and advanced algorithms to build up an intelligent manufacturing environment. Join TSMC, we are the most advanced technology team and connect with the world, as we head towards an unlimited future. We look forward to you joining us! You will be assigned to one of the following five roles according to your interest, experiences, and technical background. Responsibilities: 1. MFG Intelligent Manufacturing Engineer 2. CIM Intelligent Manufacturing Engineer 3. Data Analyst & Data Scientist 4. AMHS (Automated Material Handling System) Engineer 5. PIDS/WAT (Wafer Acceptance Test) Engineer 6. PIDS/NTO (New TapeOut) Engineer 7. Quality Management Engineer Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 6天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16574&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 廠務工程師為整合各項廠區資源,提供晶圓生產所需之電力、水、氣體、化學品、空調等,為台積高度智慧自動的生產單位,供應最高品質、最穩定的生產作業環境。近年廠務工程師更肩負環境保護與永續的責任,如何精進節水、節能、減碳、環保的廠務運轉技術,更是廠務工程師可以發揮專業與創意的主舞台。 1. Responsible for the planning, constructing, operating, and maintaining semiconductor plant facility systems, including risk analysis of facility system operations and supply quality, allocating resources and energy, managing construction safety. 2. Provide a stable facility system, including power, water, gas, chemicals and HVAC, to meet wafer production requirements. 3. Collaborate with other departments to ensure that the facility system is operating at the highest level of quality when on duty. 4. Construction management & project coordination. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 6天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16575&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 加入台積電,成為產品工程師,你將有機會參與世界級先進製程技術,與頂尖團隊合作,挑戰技術極限!你將負責協助產品導入量產、提升良率,並確保產品符合客戶的最高標準。在這裡,你將學習到最先進的半導體技術,並為推動科技發展貢獻力量。我們的專業涵蓋非常廣,從成熟廠到先進廠、從邏輯產品到特殊應用甚至到封裝測試,能夠對產品有全面的了解與完整分析的能力。 1. Leading edge product development. Learn the most advanced technology in semiconductor manufacturing, identify effective process solution for yield and chip performance improvement. 2. Involving cross-team work for joint project development. Coordinate with customer/Fab/different support team closely to address improvement opportunities and work-out the solution. 3. Expanding wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge, by using comprehensive analysis skills to solve product issue. 4. Developing HV, embedded memory, RF, MEMS, and CIS products falls under the category of 〝More than Moore〝. In this role, you will collaborate with R&D and customers to develop new applications using mature Si process technology. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 6天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16576&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: TSMC‘s advanced packaging process is an efficient and high-density packaging technology that mainly targets the demand for high-performance semiconductor components, including microprocessors, graphics processors, artificial intelligence chips, etc. This technology uses advanced 3D stacking technology to vertically stack multiple chips and uses high-density packaging materials to fix them together. This technology can improve the performance of components, reduce power consumption, reduce package size, and increase system integration. TSMC‘s packaging process includes various technologies such as CoWoS, InFO. Among them, CoWoS is a technology that connects different chips through copper wires through silicon interconnect technology to achieve high-frequency and high-speed data transmission. InFO technology directly encapsulates chips on the substrate, connecting chips and substrates through tiny copper wires, achieving a more compact and efficient packaging solution. TSMC‘s advanced packaging process can improve chip performance and production efficiency, and meet the packaging technology requirements of modern high-performance electronic products, such as smartphones, artificial intelligence, high-performance computing, and other fields. TSMC‘s advanced packaging organization include Testing R&D Engineer conduct exploratory research in DFT test architecture, evaluate next-gen test technology of several device (logic SOC, HPC, AP, RF, etc.),which used 3D silicon stacking and advanced packaging technologies and closely teamwork with international customer from new product introduction to mass production. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 6天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16577&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 品質與可靠性工程師:為守護客戶產品不受任何缺陷影響,建立優良的產品品質與可靠度,以協助客戶在市場上搶得先機、強化競爭力;QR致力於開發領先全球的電子、物理、材料與化學等科學分析專業及可靠度統計量測方法,應用於我們的產線,確保從晶片設計、製程開發、產品量產到封裝測試等階段的品質及可靠度問題皆有完整的解決方案,同時提供最先進的材料與故障分析等服務,成為公司各組織、客戶以及供應商最信任的合作夥伴。 1. Quality and Reliability roles. 2. Failure & TEM analysis, Reliability data analysis, manufacturing production quality management and reliability assessment, research, and development of new analysis protocol. 3. Customers problem resolving for production quality / reliability issues. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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  • 月薪35000~70000元 新竹縣湖口鄉 2年工作經驗 2天前更新
    1.電鍍藥液取樣/分析/添加/監控、分析機台操作 2.藥水比對分析、委託分析 3.換藥/新建電鍍鍍液 4.異常情況處置 【工作班制】 作四休二 或 作三休三 、輪班(07:20-19:20/19:20-07:20) 【工作地點】新竹湖口工業園區 ※依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘個人薪資 ※輪班津貼/班制津貼另計
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  • 面議(經常性薪資達4萬元或以上) 桃園市新屋區 3年工作經驗 10天前更新
    1.執行勞工健康保護規則及職業安全衛生法規相關醫護作業之定期更新、推動與執行(母性保護/人因性預防/異常過負荷管理) 2.勞工體格檢查之辦理、異常追蹤及資料管理保存 3.年度健康檢查之辦理、異常分析、檢康管理及資料管理保存 4.職業傷病之預防、關懷、報告與相關廠內緊急傷病處置 5.法定傳染病防治與管理 6.年度健康促進活動之規劃與辦理 7.臨場服務醫師業務之辦理與協調 8.集乳室、急救箱及醫療用物之管理分析 9.職業安全衛生相關急救教育訓練之相關工作 10.與勞工安全衛生人員實施職業病預防及工作環境之改善 11.擔任公司內外部職業健康相關議題回應及追蹤之窗口 12.定期向主管報告勞工健康服務之建議及其他協辦事項 PS.面試時,請攜帶健康促進文案成果、衛教海報、報告(如有公司內部數據可以刪除)之類的文件供面試主管參考 ▶▶▶期間限定大放送◀◀◀ ✅ 新人獎金最高 NT$47,000 加入景碩,立刻獲得肯定! ✅新人績優留任獎金最高 NT$180,000 努力不會被忽視,表現越好,獎金越豐厚! ✅ 介紹獎金最高 NT$60,000 邀請好友一起共享雙倍獎金!
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    分紅入股員工生日禮金年終獎金禮品意外險
  • 面議(經常性薪資達4萬元或以上) 桃園市中壢區 1年工作經驗 2天前更新
    1. 處理、分析及規範制定生產流程異常 2. 驗證產品導入量產與改善製程 3. 管理、執行與規畫專案 4. 客戶服務、技術支援 5. 無相關經驗可
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    產假分紅入股員工生日禮金意外險員工團保
  • 月薪54000~96000元 雲林縣虎尾鎮 4年工作經驗 2天前更新
    Linux/UNIX Server、NAS/SAN storage設備規劃、建置與維運管理,含: 日常維護、監控維護、效能調校、異常處理、安全管理、備份備援(HA/DR)、權限管理。
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    三節獎金績效獎金員工及眷屬住院慰問金上下班交通車員工健身房
  • 月薪34000~37000元 新竹縣竹北市 工作經歷不拘 2天前更新
    1.國/內外,VPC探針卡產品導入 2.客戶探針卡使用狀況回報 3.客戶端產品驗證及現場故障排除 【自我推薦獎金】 即日起,主動應徵本職缺,並到職滿三個月(試用過後成為正職員工),可得獎金6,000元。 獎勵期間自即日起至2025/12/31,視招募情況可提前結束。
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    就業保險產假產檢假安胎假家庭照顧假
  • 月薪38000~45000元 新竹縣湖口鄉 工作經歷不拘 4天前更新
    工作內容: (1) 乾式真空泵浦之新機製造、維修保養。 (2) 產品工程中檢驗、完成品檢驗相關作業。 (3) 半導體設備相關部品、零件清洗保養。 條件: 1.無經驗可,有專人培訓。 2.可配合上中班(津貼360元/天)、加班(加班費計算優於勞基法,外加誤餐費100元)。
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    就業保險安胎假產假產檢假家庭照顧假
  • 月薪51000~61000元 台中市潭子區 1年工作經驗 4天前更新
    1. 規劃調配生產資源,督導生產線之運作,有效率的達成每日生產目標。 2. 督導所屬提出改善案,皆能適時適地在單位內展開,確保改善案順利執行。 3. 執行部屬教育訓練及績效考核,提高部屬能力。 4. 具製造現場生產線管理經驗。 5.電子業1年以上管理經驗,可配合移廠到梧棲上班。 6.上班時間:日班 07:30~19:30(依約定工作日薪資51K起);夜班 19:30~07:30(依約定工作日薪資61K起),平均月休10天,每半年日夜班輪調,可配合加班。
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    員工生日禮金年終獎金員工團保員工餐廳國內旅遊
  • 月薪32000~36000元 新竹市東區 工作經歷不拘 9天前更新
    物料管理
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  • 面議(經常性薪資達4萬元或以上) 新竹縣湖口鄉 工作經歷不拘 2天前更新
    1.設備日常點檢、維修及保養 (包含:拋光機, 清洗機, 旋乾機…) 2.提升設備產能及穩定性 3.製程藥液更換及parts更換 4.SOP制定與更新:包含操作、維修及保養等 5.異常處理與分析,良率改善及製程改善 6.稽核應對與相關文件準備 7.生產管理 8.主管交辦事項
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    員工停車位或停車補助員工餐廳國內旅遊員工聚餐慶生會
  • 隨薪所欲