• 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 1天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19035&source=1111&tags=Domestic+Campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel devices developing for specialty technology. 2. Device Simulation, Test-chip design tape out and measurement system developing. 3. Process flow developing for production. 4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 1天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19034&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development productivity/quality. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 1天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19033&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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  • 月薪45000元 新北市土城區 工作經歷不拘 今天剛更新
    1.具驗光師執照 2.負責內外專業訓練課程,包含課程排定、內容規劃、招募報名、成效報告等
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    年終獎金三節獎金激勵獎金員工團保員工聚餐
  • 月薪50000元 宜蘭縣蘇澳鎮 10年工作經驗 4天前更新
    🎯職務名稱:「🎨營業主管🖌️月薪5萬起」 🎉 藤華精密機械股份有限公司誠摯邀請你的加入! 成立自民國94年,我們以「品質為核心,推動創新未來」為使命,專注於機械模具進出口,與全球夥伴聯手升級工業製造效率!在這裡,你將站在技術與業務的核心,一起開創無限可能,挑戰自我,一步步邁向更高峰!🌟 💼 福利與發展機會: - 全勤獎金與年終獎金,讓你的努力大值回報! - 員工結婚補助,團保貼心呵護您的未來! - 健保、勞保、勞退提繳全數到位,全面保障你的職場生活! - 十分尊重工作與生活的平衡,週休二日安排充足! 💡 如果你也有熱忱、有夢想,並希望置身於專業同時滿懷溫暖的團隊中,這裡將是你的理想之地!快加入我們吧,一起締造技術與創新的美好未來! ✈️ 準備好了嗎?那就今天開始你的新旅程,現在就行動!
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    需穿著員工制服全勤獎金年終獎金員工團保誤餐費
  • 月薪45000~60000元 桃園市大園區 工作經歷不拘 2天前更新
    1.電機、機械、水電設備維修保養 2.電機設備及機電儀表工具的操作知識 3.具備電路保護裝置、電動機的操作技能 4.了解配電管線及機務相關設備的操作原理 5.具有電器控制維修專長
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    年終獎金三節獎金績效獎金誤餐費員工聚餐
  • 月薪41000元 新北市蘆洲區 工作經歷不拘 3天前更新
    1. 掌控社區安全,進行建築物及周邊環境的夜間定時安全巡邏,檢查門窗是否安全無虞。 2. 監控社區監視系統,密切注意出入人員及可疑活動,確保住戶安全。 3. 執行緊急處理任務,包括回應和處理警報、入侵行為、不良活動,以及防止火災與竊盜等事故。 4. 遵循相關安全及消防程序,並熟悉急救知識以做好突發情況的應變準備。 5. 操作社區門禁與監控設備,管理鑰匙並維護門禁系統正常運作。 6. 提供良好的客戶服務,協助住戶解決問題,並負責訪客的登記與引導。 7. 管理夜間安全事件紀錄,製作相關報告並提交給主管,嚴格遵守公司安全政策和程序。 歡迎對於維護社區安全充滿熱忱的您加入我們,與我們共同打造一個安心的居住環境!加入我們,立刻投遞履歷!
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    勞保健保職災保險
  • 月薪41000元 新北市蘆洲區 工作經歷不拘 3天前更新
    我們是一家專注於提供優質社區物業管理服務的公司,致力於讓每一位住戶享受安全、舒適的居住環境。透過專業的管理團隊,我們為社區提供全面性管理與技術支援,涵蓋安全管理、公共設施維護以及住戶服務等範疇。 工作內容: 1. 負責定期對社區公共設施及設備進行檢查與維護,確保其正常運作。 2. 巡邏建築物與其周邊,檢查門窗安全,維持社區安全秩序。 3. 管理訪客登記與出入管制,提供專業且友善的接待服務。 4. 定期執行消防安全設備的檢查,包括滅火器、警報系統以及相關消防措施,以確保安全性能。 5. 回應社區內住戶的投訴與需求,解決問題並提供即時幫助。 6. 負責監看監控設備,確保即時掌握社區中各項異常情況及處理。 7. 協助安排團隊人員排班,並確保日常管理流程的順利運行。 8. 編寫日常工作記錄與月度報告,確保作業結果清楚且準確。 歡迎加入我們的專業管理團隊,共同致力於打造一個安全、愉悅、高品質的社區生活環境!立即投遞履歷,我們期待您的加入!
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    勞保健保職災保險
  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 1天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19032&source=1111&tags=domestic+campus+2026_1111 台積公司成立於1987年,率先開創了專業積體電路製造服務之商業模式,自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展,以此釋放全球半導體產業的創新。身為全球的企業公民,台積公司的營運範圍遍及亞洲、歐洲及北美,致力成為企業社會責任的行動者。2024年,台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術,為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 因為期待無限可能,所以選擇台積。 台積致力於營造具挑戰性、可以持續學習而又有樂趣的工作環境,提供同業平均水準以上的薪酬與福利。 加入台積,您將與世界一流的優秀夥伴共事,透過最先進的製程技術,成就改變世界的大事,所有突破與創新,都有一份我們的努力。 歡迎「志同道合」的你,透過本計畫提前完成〝〝線上應徵〝〝註冊履歷,符合資格者,將享有優先面試的機會唷! 如您對台積電2026校園徵才計畫感興趣,歡迎報名參加,以掌握台積趨勢、組織概況與求職撇步。 此外,我們特別為同學安排了校園徵才實體與線上說明會,歡迎踴躍報名參加,以便了解公司市場趨勢、組織概況,並掌握求職技巧! 報名連結:請參考官網連結 (採線上報名,報名成功後將由系統自動發送活動通知信件,可重複報名不同場次。) 請線上應徵此「校園徵才活動」,如您已有求職偏好職缺,再根據以下職位額外投遞2至4個職位。 ▋歡迎志同道合的夥伴,一起加入台積 ▋世界上的每一個夢,都由我們來圓夢 Join TSMC: Where Infinite Possibilities Await. At TSMC, we believe in creating a challenging, continuous learning, and enjoyable work environment. We offer competitive compensation and benefits that exceed industry averages. Join us, and you‘ll collaborate with world-class talent, leveraging the most advanced process technologies to achieve breakthroughs that change the world. Every innovation and advancement carry the mark of our dedication. Are you ready to make an impact? We invite like-minded individuals to pre-register and submit resumes online through the 2026 Campus Recruitment Program. Qualified applicants will receive priority interview opportunities! We are organizing both on-campus recruitment and online information sessions. We encourage you to sign up for the upcoming events to gain insights into the market trends, organizational overview, and master essential interview skills. Registration Link: Click Here (Pre-registration is required – After registration, you will receive an email notification sent by the system afterwards. You may register for multiple sessions.) Please apply online for this Campus Recruitment Event. If you already have preferred job openings, you may additionally apply for 2 to 4 positions from the list below on career site. 2026 台積電校園熱門職缺 TSMC Campus Recruitment Hot Jobs : R&D (研究與發展組織)  1-1 Research and Development Engineer (R&D)  1-2 Design and Technology Platform Engineer (DTP)  1-3 Specialty Engineer (Specialty)  1-4 Integrated Interconnect and Packaging Engineer (IIP) Operations (營運組織)  2-1 Process Integration Engineer (PIE)  2-2 Process Engineer (PE)  2-3 Equipment Engineer (EQ)  2-4 Intelligent Manufacturing Engineer (IMC/MFG)  2-5 Facility Engineer (FAC)  2-6 Product Engineer (PE)  2-7 Advanced Packaging Technology & Service Engineer (APTS)  2-8 Quality & Reliability Engineer (Q&R)  2-9 Module Associate Engineer (MAE) 儲備模組副工程師  2-10 Technician 技術員 Corporate Business (策略暨支援組織)  3-1 Information Technology (IT)  3-2 Corporate Planning Organization (CPO)  3-3 Materials Management (MM)  3-4 Human Resources (HR)  3-5 Finance, Accounting and Risk Management (FIN) 營造一個合乎台積公司核心價值與經營理念的全球共融職場,對於公司未來成功至關重要。台積公司對全球共融職場的承諾,旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向,都能將其自身的觀點與經驗帶入工作,促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融,讓每一位員工都覺得被重視且有能力為企業使命提供貢獻,並為全球各戶提供卓越服務。
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  • 月薪60000元 新竹縣竹北市 工作經歷不拘 1天前更新
    江海全聯股份有限公司現正招募具專業背景與實務經驗的護理師,加入我們穩健且溫暖的團隊。 這份工作除了提供董事長及其家人的日常健康照護外,也包括部分公司同仁的基本護理與協助,內容多元且富有挑戰性。適合擁有靜脈注射經驗,並樂於發揮彈性與責任感的你。 我們希望你具備: - 靜脈注射經驗 - 高配合度與服務熱忱 - 穩重細心,樂於團隊合作 工作時間: 表定 08:30-18:00,實際時間彈性、可面議 薪資待遇: 月薪 NT$60,000 起,依經驗與能力可調整
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    就業保險產假產檢假免費供餐員工健身房
  • 月薪45000~48000元 新竹市北區 1年工作經驗 3天前更新
    1.社區管理委員會及區分所有權人會議籌備、召開。 2.公告、通知、函文、會議記錄撰寫、公告、寄發。 3.請、收款管理及收支紀錄呈報與製作。 4.招商、廠商管理及訪價、簽約與驗收作業。 5.行政報表製作與檔案及電子帳號管理。 6.住戶申訴或意見處理。 7.安全、環境清潔與設施設備維護管理。 8.其他委員會交辦事項。
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    意外險員工團保產假產檢假全勤獎金
  • 年薪587000元 台南市永康區 工作經歷不拘 今天剛更新
    1. 臨床物理治療工作(包括:神經、骨關節、小兒物理治療服務ヽ支援榮家、居家復能ヽPAC、夜間門診物理治療服務) 2. 臨床教學相關之行政業務 3. 配合醫院政策之臨時交辦業務。
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