1. Package related structure stress analysis including warpage, material study.
2. Package and board level stress modeling for TCT, drop and vibration.
3. IC and package thermal analysis, modeling and characterization
4. Chip-Package-PCB thermal co-simulation and design.
5. System level thermal simulation 6. System level stress simulation
1. Write or port device drivers
2. Write hardware module testing program
3.Perform hardware module pre- and post-silicon validation
4. optimize system low power performance and analyze system issues