- 面議（經常性薪資達4萬元或以上） 新竹縣竹北市 6年工作經驗 4天前更新展開
1. 設計和開發基於QNX的嵌入式軟體，特別是車用cockpit平台，確保系統的穩定性和高效性。 2. 熟悉QNX的軟體開發平台(SDP)組件，並能夠快速掌握技術知識。 3. 提高系統除錯效能，確保軟體的穩定性和可靠性。 4. 與產品和服務工程團隊合作，定義和實現軟體功能，滿足車用平台的需求。 5. 與產品管理和開發團隊緊密合作，澄清和詳細說明產品需求，確保需求的準確性和可行性。 6. 支持全球客戶需求，根據團隊計劃和優先事項，應對資源和技術挑戰。
- 月薪45000~45000元 新北市新莊區 3年工作經驗 4天前更新展開
1. 能有效管理總經理的行程、差旅規劃與會議安排、並隨行陪同 2. 能適應快節奏、高壓的工作環境，並妥善處理多任務與突發狀況 3. 能協助總經理追蹤、推動專案，負責追蹤執行狀況，隨時掌控進度 3. 處理總經理交辦的臨時任務及其他相關工作 不定期出差 英文精通(聽、說、讀、寫)，需可與外商直接協助溝通能力
- 面議（經常性薪資達4萬元或以上） 新竹市東區 8年工作經驗 4天前更新展開
先進封裝技術開發 1. 先進新產品導入技術開發 (新產片試產規劃, DRC/DRM檢驗, DOE及良率改善規劃, 量產區間及良率分析) 2. 熟悉先進chiplet及3DIC封裝技術開發 3. 晶圓級與面板級先進封裝結構設計
- 面議（經常性薪資達4萬元或以上） 新竹市東區 4年工作經驗 4天前更新展開
* 資深SI/PI工程師 * 封裝/電路板 SI/PI設計與晶片開發於消費型產品, 車用以及企業級高效運算產品 * 記憶體以及高速Serdes SI/PI設計 * 高效能CPU/GPU/APU PI以及PDN設計 * 建立封裝/電路板的高速序號設計準則, PDN電氣規格, 以利產品進行
- 面議（經常性薪資達4萬元或以上） 新竹市東區 6年工作經驗 4天前更新展開
1. 應用於I/O 小晶片的 SerDes 設計驗證工作. 包含從原型測試到量產晶片, 並與類比, 數位和演算法設計團隊合作. 2. 負責實現 SerDes 韌體設計, 以驗證連線效能和實現量產測試 3. 負責建立自動測試和資料分析, 以測試SerDes的晶片特性和分析失效晶片
- 面議（經常性薪資達4萬元或以上） 新竹縣竹北市 2年工作經驗 4天前更新展開
1. 負責高速 Serdes相關開發, 包含驗證, 客戶支援 (熟悉架構, 韌體、除錯、優化及測試等工作項目) 2. 開發測試自動化 3. 協同團隊共同完成系統雛型建立及性能優化與調適 4. 達成客戶端產品導入，並支援產品量產
- 面議（經常性薪資達4萬元或以上） 新竹市東區 8年工作經驗 4天前更新展開
We are looking for a highly experienced PISI Technical Leader to join our team. The ideal candidate will have extensive experience in Power Integrity and Signal Integrity, with a strong background in high-speed IO interface simulations and PDN analysis. As a PISI Technical Leader, you will guide customers through Signal Integrity and Power Integrity signoff, model and optimize system components, and collaborate with various teams to ensure optimal package, PCB, die, interposer, and substrate designs. 1. Guide customers to complete Signal Integrity and Power Integrity signoff. 2. Model and optimize vias, connectors, sockets, breakouts, and various system components using commercial tools. 3. Perform system-level signal integrity simulation in high-speed IOs such as PCIe, SerDes 4. Architect and simulate power delivery systems, including multiple dies, substrate, interposer, PCBs, and on-die PDN models. 5. Collaborate with multiple teams, including layout, design, and customers, to optimize package, PCB, die, interposer, and substrate designs.
- 面議（經常性薪資達4萬元或以上） 新竹市東區 6年工作經驗 4天前更新展開
The Senior Power Integrity Engineer is responsible for the design and analysis of Power Delivery Networks (PDNs), encompassing voltage regulators, PCBs, substrates, and silicon dies, to drive strategic technology development for data center SoCs. Key responsibilities include conducting power integrity pathfinding, developing both detailed and reduced-order PDN models, and optimizing PDN performance through comprehensive time-domain and frequency-domain analysis. This role requires proficiency in scripting and design automation, as well as expertise in analytical methods and commercial simulation tools (e.g., 2.5D EM solvers) to extract PCB and package impedance profiles and generate accurate N-port models.
- 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 4天前更新展開
• Design, simulate and test various building blocks for photonic ICs such as modulators, filters, and detectors. • Develop mathematical models of photonic components for co-simulation with electronic circuits. • Contribute to the integration and testing of Photonic & Electronic ICs, collaborate with cross functional teams to improve system performance and optimize designs. • Must be proficient in programming (e.g. Python or MATLAB) for design automation
- 面議（經常性薪資達4萬元或以上） 新竹市東區 8年工作經驗 4天前更新展開
The Senior Manufacturing and Test Engineer is responsible for improving manufacturing and test flows to optimize quality, yield and power in AI ASICs. Activities include DFT definition, coverage analysis and test content improvements at socket & system level to drive yield and quality. Collaboration across design and manufacturing teams to correlate pre-silicon to post-silicon through data analysis, building quality models and driving optimizations is expected. Deep understanding and experience in DFT architecture, quality, yield and power measurement flows is needed.
- 面議（經常性薪資達4萬元或以上） 新竹市東區 5年工作經驗 4天前更新展開
1.Telematics product market analysis and strategy planning 2.Telematics product competition analysis and roadmap planning 3.Product promotion: Go to market promotion for OEM/Tier1/Tier2 customers and new product launch promotion Deliverables: Create and maintain market models, account customer product line management, conduct product competition analysis , Provide strategic recommendations for long-term product roadmap planning
- 面議（經常性薪資達4萬元或以上） 新竹市東區 3年工作經驗 4天前更新展開
1.PCB power related hardware design：Resonsible for design and develop hardware including circuit design, component evaluation and selection, customized component planning, layout review, etc. 2. System specification and design requirement collection. 3. System hardware verification and testing: function verification and power quality measurement. 4. Cross-organizational collaboration: Collaborate with IC design team, system team, SI/PI team, layout team, etc. to complete system design, production and verification. 5. Customer and related manufacturer support: including technical document writing, customer reference design support, on site support, etc.
- 面議（經常性薪資達4萬元或以上） 新竹縣竹北市 6年工作經驗 4天前更新展開
1. SIP Module Business model & Technology Roadmap Planning 2. SIP (System in Package) Module strategy, state of Art technology to realize complex SIP module with complex SOC, PMIC, Memory within the SIP module. 3. Establish an echo system partners from technology Partners as Memory, Power Management and also Industrialization partners who support latest package & manufacture technology to realize SIP module robust, compatible and commercially competitive. 4. Well define SIP product specification and process. 5. Support OEM & Tier 1 customers‘ integration concept. 6. Identify value added for our products, from technology and also system level commercial aspect
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