- 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 4天前更新展開
As deep sub-micron process requires longer research cycle and higher manufacture cost, DV(design verification) has become an inevitable part of design group in Mediatek chip development flow. CDG DV is in charge of development and implementation of smart phone, TV, and ASIC product line verification plan. It included: integrated simulation/verification env development, big data analysis and efficiency improvement, bus fabric / EMI (External memory interface ) / Low power functions verification plan and implementation Need to build up verification plan/bench and continuously improve methodology, and you will understand both detail scenario and global view of cell phone/ASIC operating schemes Need to leverage the latest EDA tool and concept to accomplish the verification plan Work location: Hsinchu/Taipei
- 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 4天前更新展開
[職缺內容] 1. 生成式 (Gen AI) 應用程式 for Camera Productivity Applica開發 (Win Form, Frontend) 2. 生成式 AI 技術 Survey 與 Landing [團隊簡介] 1.加入多媒體部門 (MM), 會專注核心相機軟體研發, 提供開放軟體架構給予不同產品線使用 2.重視軟體設計思維與軟件工匠團隊文化, 創造 Incredible In, Incredible Out 的相機應用軟件 3.落實 Solid 軟體開發流程,從軟件設計規範, 到執行 Code Review, Documentation 與 Auto Test 4.持續建置 Knowledge Base 與經驗傳承, Open Mind 持續導入創新而能提升生產力的 Methodology & Process 5.重視團隊 Partners 的 Career Path, Soft & Hard Skill Build p, 期待長期合作關係與相互成長 [加分項] 1.有前端 (Frontend) 與後端 (Backend) 的開發與佈署經驗, 不限語言與框架 2.有 Database 的 Scheme 設計與 Database 的使用經驗, 不限使用原生 SQL 或是 ORM (Object Relational Mapping) 3.有使用 RESTful API 進行程序整合的經驗 4.有 H5 與 Java Script 的開發經驗 5.有網路爬蟲 (Web Crawler) 經驗 [人選特質] 1.積極正面的態度: 期待人選能以正面的心態迎接工作中的挑戰, 並從中發掘成長與機會 2.終身學習精神: 在快速變化的科技領域, 持續學習是必要的, 期待人選對於新技術和知識有持續的熱情和追求 3.勇於面對挑戰: 面對困難或新領域時, 人選應具備勇氣和決心, 積極尋找並實施解決方案 4.邏輯思維能力: 清晰的邏輯思維對於軟體開發至關重要, 期待人選能夠系統性地分析問題, 並設計出合理且有效的解決方案 5.深思熟慮: 在決策時, 期待人選能深入考慮各種可能性和後果, 並能夠做出周全的決定, 考量的是整體解, 並非局部解法
- 面議（經常性薪資達4萬元或以上） 新竹市東區 8年工作經驗 4天前更新展開
1. New SBT vendor bring up , New SBT vendor YIP , troubleshooting and Ops 2. 3D, 3.5D & e-IVR Technology Enabling, CPC/CPO technology building block development 3. Common strip format unification management 4. Advanced PCB Ultra-Large size. I.e., CoWoP, DCAI PCB w/ high layer counts (PCB vendor ISU, GCE, UMTC, VGT ) 5. PCB technology development and DRM owner
- 月薪29500~48000元 新竹市東區 工作經歷不拘 4天前更新展開
(請留意：為加快面試安排時間，僅限定投遞5個職缺)我們在找這樣的你：對行動通訊、無線及寛頻連結、家庭娛樂晶片解決方案有濃厚興趣；勇於表達意見，以團隊成功為目標，面對困難不輕易放棄，總是在想更好的做法，擁有創新及不斷學習的精神。聯發科技邀請您，與全球最頂尖的菁英一同合作，彼此激盪最新的創意與解法，共同挑戰每一個不可能。
- 面議（經常性薪資達4萬元或以上） 新竹市東區 8年工作經驗 4天前更新展開
1. SoC IC implementation 規劃設計 2. DFT 規劃設計 以及timing closure signoff 3. 設計方法流程開發及優化 4. 工作地點:新竹/台北
- 面議（經常性薪資達4萬元或以上） 台北市內湖區 2年工作經驗 4天前更新展開
1. 優化數位 IC 設計 BE 流程與方法 2. 執行與管理數位 IC 設計 BE 相關任務 (2.a) Physical aware synthesis, DFT-SCAN, DFT-MBIST insertion (2.b) STA timing analysis 與 fixing (2.c) Netlist level QC，例如 CLP 3. 與 FE RTL designer 及 PD APR 團隊密切合作，針對 PPA（Performance, Power, Area）進行 design 及 clock structure 的優化 4. 將依應徵者的年資與專業經驗，提供不同的職級
- 面議（經常性薪資達4萬元或以上） 新竹市東區 4年工作經驗 4天前更新展開
1. Own the top-level integration of internal and third-party IPs into SOC or FPGA platform. 2. Ensure interface compatibility, clock/reset domain correctness. Resolve integration issues including timing, CDC/RDC, and floorplan. 3. Work closely with architect to define specification, support physical design team through synthesis constraints and integration guidance, partner with firmware and validation teams to ensure smooth bring-up and validation.
- 面議（經常性薪資達4萬元或以上） 新竹市東區 4年工作經驗 4天前更新展開
1. Develop Ethernet MAC for HPC networking applications. 2. Work closely with architecture, verification and physical teams from specification to implementation.
- 面議（經常性薪資達4萬元或以上） 台北市內湖區 4年工作經驗 4天前更新展開
1. Develop Die-to-die and UCIe digital IP for HPC SOC. 2. Integration of D2D controller and PHY to timing closure and DFT. 3. Define interface specifications, creating comprehensive verification plans, and support integration and physical implementation. 4. Work closely with multiple teams such as mixed mode designers and Firmware engineers.
- 面議（經常性薪資達4萬元或以上） 台北市內湖區 8年工作經驗 4天前更新展開
1. Researching and crafting architecture solutions for die-to-die and chip-to-chip communication, optimizing for performance, area, power, security, and resiliency 2. Working with other design teams to define interfaces and flows between D2D blocks and the rest of the chip 3. Architectural modeling, validation, definition and documentation 4. Driving implementation across design, verification, firmware and software teams
- 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 4天前更新展開
【About the Role】 Join our cutting-edge team to shape the future of communication technologies. As a key member of our engineering team, you will be at the forefront of developing innovative baseband algorithms, designing robust Ethernet or PCIe/USB4 PHY systems. Your expertise will drive the creation of low-power, high-speed communication systems and advance the digital signal processing of mixed-signal systems. Additionally, you will play a pivotal role in representing our company at IEEE/OIF standard meetings, influencing the future of communication standards. With the rapid advancement of Generative AI, the demand for high-speed Serializer/Deserializer (SerDes) in data center applications is skyrocketing. This trend presents significant business opportunities, and you will be instrumental in capitalizing on these developments. 【Key Responsibilities】 1. Develop state-of-the-art baseband algorithms to enhance communication system performance. 2. Architect and design Ethernet or PCIe/USB4 PHY systems, focusing on system efficiency and reliability. 3. Lead communication system verification efforts to ensure system integrity and performance. 4. Innovate in architecture and algorithm design for low-power, high-speed communication systems. 5. Apply digital signal processing techniques to optimize mixed-signal system functionality. 6. Actively participate in IEEE/OIF standard meetings, contributing to the development of industry standards. 7. Leverage the trend of Generative AI to drive the development of high-speed SerDes solutions for data center applications.
- 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 4天前更新展開
1. Serdes/High speed interface related PHYD IP architecture planning. 2. Serdes/High speed interface related PHYD IP RTL coding. 3. Serdes/High speed interface related PHYD IP front-end and back-end integration. 4. Co-work with MAC design team and DV team for IP verification. 5. Co-work with Analog design team for PHY co-simulation.
- 面議（經常性薪資達4萬元或以上） 新竹市東區 4年工作經驗 4天前更新展開
•重點開發技術: 系統軟韌體開發、高速資料實體層(physical layer) 資料傳輸軟體開發、優化硬體效能及產品量產品質控管 •主要目標: 完成Enterprise/AI/xPU等相關產業客製化IC的軟韌體開發與系統整合，並協助客戶產品量產 •負責新產品的系統設計與開發，確保符合公司及客戶的需求 •協助量產過程中的技術問題解決，並提供專業建議以提升生產效率與品質 •與跨部門團隊合作，確保產品從設計到量產的順利過渡 •分析並改善現有系統和流程，以提高產品質量和生產效率 •參與產品測試和驗證，確保產品符合相關標準和規範
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