面議(經常性薪資達4萬元或以上) 新竹市東區 4年工作經驗 今天剛更新
1. Automotive Packaging development, New product introduction, Mass production, Supplier management.
2. Develop and evaluate the advanced IC Package technology.
3. Collaborate with the assembly subcontractors to complete the technology development.
4. Qualification and yield improvement for the advanced IC Packages.
5. Audit subcontractors.
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