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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 高雄市前鎮區 8年工作經驗 今天剛更新展開
職責要求 1.制定品牌策略與年度主題 : 規劃品牌長期發展方針、核心價值、年度品牌主題與集團品牌承接策略，支持高階經營決策。 2.維護品牌一致性與市場定位 : 確保客房、餐飲、會員俱樂部等各營運端之品牌視覺、定位、產品設計與對外形象一致，並具市場競爭力。 3.統籌公關傳播與媒體關係:規劃年度及階段性公關傳播計畫，維繫媒體、政府機關、KOL 關係，主導採訪、公關活動與宣傳企劃執行。 4.管理品牌預算、專案與跨部門協作 : 負責品牌推廣與公關預算編列、資源調配、成本效益控管，並建立跨部門品牌溝通 SOP，推動大型節慶、聯名與品牌專案。 5.負責輿情監控、危機處理與 ESG 品牌溝通 :建立即時輿情監控機制，處理負面評論與突發事件，統一對外溝通口徑；同時將 ESG 理念融入品牌核心，確保對外宣傳與企業實際作為一致。 任職資格 1.大學以上，具有品牌管理/公關或行銷策略規劃相關經驗 8 年以上，具有5年以上團隊管理經驗 2.具媒體公關與危機處理能力 3.具良好跨部門溝通能力
國內、外旅遊補助生育補助年終獎金員工團保三節獎金 - 月薪40000~45000元 桃園市桃園區 工作經歷不拘 今天剛更新展開
【大樹藥局】儲備幹部計畫開跑 這是一個從第一線到決策核心的培育計畫 快速了解一間公司的運作 不只是執行，而是參與決策。 ––––––––- 培訓時間：一年 培訓事項： 第一階段｜門市營運基礎 熟悉第一線運作、了解門市營運及流程 第二階段｜後勤單位歷練 後勤單位基礎作業訓練 第三階段｜核心任務承接 實際參與單位運作，承接明確任務與績效指標 第四階段｜專案參與 跨部門專案執行，接觸策略與決策思維 資格條件： 1.科系：不拘 2.精通英文或日語 3.多益成績:700↑(須提供相關證明，例:成績單、證書) 特質： 1.具高抗壓性、積極、耐心、細心之特質 2.良好的溝通協調、邏輯、分析能力 3.工作積極有熱忱，有強烈的責任感，願意挑戰自我
禮品激勵獎金績效獎金員工團保三節獎金 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 今天剛更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22578&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們確保晶片的品質、持續提升良率，提供給客戶具有競爭力且高品質的晶片，讓電子產品不但先進且效能穩定；製程整合工程師為半導體製造中的重要協調者，需要與客戶溝通了解客製化的晶片應用需求，再將訊息帶回廠內，與各工程單位合作。良率精進工程師監控晶片的良率與缺陷，使用量測機台監測晶片的缺陷，找出可能的問題，再與製程解決問題。 1. A highly motivated individual with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, troubleshooting equipment and mentoring technicians. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 月薪50000~65000元 台南市新市區 工作經歷不拘 今天剛更新展開
請提前投遞職缺報名，也歡迎現場了解與面談！ 活動地點：C-Hub成大創意基地 1.定期維護、保養生產設備機台 2.生產機台故障排除及異常查修 3.設備問題改善及異常分析與追蹤處理 4.維持生產機台設備的正常運轉 ※ 無經驗可(完整在職訓練) 薪資條件： 工作20天(含5天加班天) 早班50,000~55,000元(含早班津貼及加班費) 夜班60,000~65,000元(含晚班津貼及加班費)
國外旅遊員工聚餐慶生會尾牙自強活動 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 今天剛更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22576&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel process/device/product developing for Specialty technologies. 2. Process Integration/Module, Device Analysis/Simulation, Modeling, Test-chip design tape out and WAT/Bench measurement system developing. 3. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 月薪50000~65000元 台南市新市區 工作經歷不拘 今天剛更新展開
CIM自動化設備工程師招募｜南科廠｜7/25 假日徵才 請提前投遞職缺報名，也歡迎現場了解與面談！ 活動地點：C-Hub成大創意基地 1.自動化機構保養 2.自動化機構異常排除/分析 3.自動化作業資料分析 工作時間:需配合四班二輪(做2休2)輪班，2個月輪一次早晚班 **【加班費、輪班津貼、獎金另計】**
國外旅遊員工聚餐慶生會尾牙自強活動 - 月薪40000元 高雄市楠梓區 工作經歷不拘 今天剛更新展開
我們是一家專注於先進半導體技術的公司，致力於為全球客戶提供高效能半導體製程解決方案。我們的服務主要涵蓋製程技術研究、設備管理以及跨領域技術合作，服務對象包括全球知名科技公司與製造業客戶。 須配合無塵室環境並接受派駐日本。 工作內容： 1. 負責開發和優化半導體製程技術，包括製造工藝設計與數據分析，確保新產品製程順利導入量產。 2. 熟練操作半導體製程設備，進行相關製程數據的分析及效能提升。 3. 執行設備日常維護及故障排除，撰寫設備技術報告，並進行技術升級和改善。 4. 分析製作晶片設計規格，參與IP演算法研究及數位模組設計。 5. 測試半導體元件與積體電路，對設備進行精確調試及檢測。 6. 負責無塵室設備的日常維護，並制定設備保養計畫以確保生產順暢與提升產品良率。 7. 與跨部門技術團隊進行協作與技術支持，協助處理製程相關問題。 8. 撰寫技術文件與申請專利，密切關注技術發展與市場趨勢。 我們歡迎對尖端半導體產業充滿熱忱的人才加入我們的行列！加入我們的團隊，您將有機會參與全球範圍的技術專案，見證和塑造科技的未來。立即投遞履歷，我們期待您的加入！
全勤獎金年節獎金年終獎金三節獎金意外險 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 今天剛更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22575&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development. productivity/quality. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 月薪50000~65000元 台南市新市區 工作經歷不拘 今天剛更新展開
1.定期維護、保養生產設備機台 2.生產機台故障排除及異常查修 3.設備問題改善及異常分析與追蹤處理 4.維持生產機台設備的正常運轉 ※ 無經驗可(完整在職訓練) 薪資條件： 工作20天(含5天加班天) 早班50,000~55,000元(含早班津貼及加班費) 夜班60,000~65,000元(含晚班津貼及加班費) *高雄南科廠正式生產前，將先於高雄楠梓廠訓練，之後再依照南科廠產能作調動。
國外旅遊員工聚餐慶生會尾牙自強活動 - 面議（經常性薪資達4萬元或以上） 新北市五股區 2年工作經驗 今天剛更新展開
📢 徵才｜機械設備繪圖員 職務名稱： 機械設備繪圖員 工作內容 機械設備圖面繪製與修改 CAD圖面製作及校對 配合工程需求完成設計圖面 主管交辦事項 應徵條件 ✔ 具機械設備繪圖相關工作經驗 ✔ 熟悉 AutoCAD（CAD）繪圖軟體操作 ✔ 具相關繪圖或技術證照者佳 ✔ 工作細心、具責任感，能獨立作業 薪資待遇 面議（依工作經驗及能力敘薪） 工作地點 新北市五股區民義路2段35-3號 上班時間 早上8:00-下午5:00，中午休息一小時。 福利制度 勞健保、年終獎金、三節禮金、供餐。 歡迎具備相關經驗者加入我們的團隊！
全勤獎金年節獎金意外險員工團保員工宿舍 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 今天剛更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22574&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : Come and join an innovative and challenging team, where groundbreaking ideas shape the future of semiconductor technology. As an R&D Engineer, you will work on advanced technology development, such as exploratory research in advanced device architectures, device and process integration for manufacturability, advanced module process development, as well as the evaluation of novel materials, equipment, and processes. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration For Device Engineers: (1) Transistor Architecture & Design: Pioneering device design for advanced nodes. (2) Advanced Characterization: Defining the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting bench electrical measurements (I-V, C-V). (3) Simulation & Modeling: Utilizing TCAD (Technology Computer-Aided Design) and HSPICE to simulate device characteristics, optimize performance, and fortify model integrity. (4) Test Key Design: Crafting precision test key designs to facilitate accurate electrical modeling, design rule validation, and comprehensive device characterization. (5) Customer design enablement: Providing SPICE Model. For Integration Engineers (or Process Integration Engineers) : (1) Process Flow Integration: Integrating devices across various process modules (Lithography, Etch, Thin Films/Epi, Diffusion, CMP) to build a robust, manufacturable baseline for yield and device learning. (2) Experimentation & Lot Handling: Designing advanced Experiments (DOE) to meet device KPIs. Periodically serving as the on-duty engineer to coordinate and handle device lots in the R&D fab. (3) Yield & Reliability Learning: Conducting big data analysis (using JMP, Python, or custom iEDA tools) to identify process design weaknesses, hardware issues, or yield detractors. (4) Technology Transfer: Transitioning the proven, optimized advanced integration baseline process from the R&D phase to fab for high-volume manufacturing. 3. Module R&D Engineer (1) Pioneer Next-Generation Technologies: Research and develop advanced processes, novel materials, next-generation tooling, and cutting-edge computational/simulation methodologies for leading-edge semiconductor nodes. (2) Drive High-Impact Innovation: Deliver highly manufacturable, stable, and cost-effective process technologies. Optimize device physics and performance to meet stringent yield, reliability, and qualification standards. (3) Bridge Lab-to-Fab Scaling: Lead the technology transfer of advanced processes and hardware solutions from R&D phase to High-Volume Manufacturing (HVM) fabs, witnessing your research scale into global production. 4. R&D Process Center (1) PE: Develop advanced module process, optimizing stability and manufacturability to ensure high yield and reliability. Transfer processes and tools to volume manufacturing while collaborating with cross-functional teams and external suppliers to drive leading-edge module integration. Additionally, manage day-to-day operations, troubleshoot equipment, and mentor technicians to sustain operational excellence. (2) EE: Manage advanced semiconductor equipment (Diffusion, Thin Film, Lithography, or Etching) by performing warm-ups, troubleshooting, and efficiency enhancements. Plan and execute defect detection projects to analyze performance while collaborating closely with cross-functional engineers and vendors to ensure optimal equipment productivity and stability. (3) MFG: Oversee daily IC foundry operations, managing work schedules, direct labor, and cross-functional collaboration (PE/PIE/EQ) to ensure consistent service delivery. Drive productivity, manage multiple projects with overlapping deadlines, and analyze data to keep operations running smoothly. Additionally, contribute to process improvements and maintain robotic/detection systems to meet customer and business objectives.
- 月薪42000元 台中市西區 工作經歷不拘 今天剛更新展開
排班輪休制，工作細心負責，需有社區密經驗。 歡迎有自信心，企圖心的優秀的你加入我們的團隊。 1.傳達上級命令以及希望達成的目標給基層員工。 2.監督基層員工工作情形。 3.教導基層員工給予基層員工需要協助。 4.人事排班調度。 5.人事聘任、留任…等人事管理。
需穿著員工制服員工在職教育訓練良好升遷制度員工生日禮金績效獎金 - 月薪42000元 台中市西屯區 工作經歷不拘 今天剛更新展開
1.執行理事會之決議 2.聘僱與解聘所屬員工 3.指揮監督所屬員工推行會務與業務 4.訓練、考核、獎懲所屬員工
需穿著員工制服員工在職教育訓練良好升遷制度員工生日禮金績效獎金 - 月薪46000元 台中市后里區 工作經歷不拘 今天剛更新展開
1. 條線廠【RSB整備員】技術員 主要職務： ※ 精密軋延機組輥。 ※ 出入口整備。 ※ 輥環車削。 ※ 機台整修等。 2. 本公司有一貫培訓教育機制，操作與維護工作均有輪調機制。 –––––––––––––––––––– ▲ 操作維修技術性質，具CNC工具機相關經驗者佳。 ▲ 需配合［輪班排休］，常態性早、中、晚班輪。 ▲ 輪班津貼/加班費 另計。
社團補助需穿著員工制服員工在職教育訓練良好升遷制度員工（調職）搬家安家費 -
