面議(經常性薪資達4萬元或以上) 東南亞新加坡 3年工作經驗 3天前更新
1.Develop and optimize 300mm Silicon Photonics (SiPh) technology platforms, including pluggable modules, co-packaged optics (CPO), and photonic interposer solutions.
2.Collaborate with internal R&D and module engineering teams to define and execute SiPh process flows.
3.Align device and process requirements with customers through technical discussions and solution deep dives.
4.Coordinate with external OSATs and partners for PIC/EIC characterization and packaging integration.
5.Apply DOE, FMEA, and control plan methodologies to ensure robust development and effective risk mitigation across all phases
展開 產假分紅入股員工生日禮金年終獎金三節獎金