- 面議（經常性薪資達4萬元或以上） 新竹市東區 8年工作經驗 今天剛更新展開
1. SoC IC implementation 規劃設計 2. DFT 規劃設計 以及timing closure signoff 3. 設計方法流程開發及優化 4. 工作地點:新竹/台北
- 面議（經常性薪資達4萬元或以上） 台北市內湖區 2年工作經驗 今天剛更新展開
1. 優化數位 IC 設計 BE 流程與方法 2. 執行與管理數位 IC 設計 BE 相關任務 (2.a) Physical aware synthesis, DFT-SCAN, DFT-MBIST insertion (2.b) STA timing analysis 與 fixing (2.c) Netlist level QC，例如 CLP 3. 與 FE RTL designer 及 PD APR 團隊密切合作，針對 PPA（Performance, Power, Area）進行 design 及 clock structure 的優化 4. 將依應徵者的年資與專業經驗，提供不同的職級
- 面議（經常性薪資達4萬元或以上） 新竹市東區 4年工作經驗 今天剛更新展開
1. Own the top-level integration of internal and third-party IPs into SOC or FPGA platform. 2. Ensure interface compatibility, clock/reset domain correctness. Resolve integration issues including timing, CDC/RDC, and floorplan. 3. Work closely with architect to define specification, support physical design team through synthesis constraints and integration guidance, partner with firmware and validation teams to ensure smooth bring-up and validation.
- 面議（經常性薪資達4萬元或以上） 新竹市東區 4年工作經驗 今天剛更新展開
1. Develop Ethernet MAC for HPC networking applications. 2. Work closely with architecture, verification and physical teams from specification to implementation.
- 面議（經常性薪資達4萬元或以上） 台北市內湖區 4年工作經驗 今天剛更新展開
1. Develop Die-to-die and UCIe digital IP for HPC SOC. 2. Integration of D2D controller and PHY to timing closure and DFT. 3. Define interface specifications, creating comprehensive verification plans, and support integration and physical implementation. 4. Work closely with multiple teams such as mixed mode designers and Firmware engineers.
- 面議（經常性薪資達4萬元或以上） 台北市內湖區 8年工作經驗 今天剛更新展開
1. Researching and crafting architecture solutions for die-to-die and chip-to-chip communication, optimizing for performance, area, power, security, and resiliency 2. Working with other design teams to define interfaces and flows between D2D blocks and the rest of the chip 3. Architectural modeling, validation, definition and documentation 4. Driving implementation across design, verification, firmware and software teams
- 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 今天剛更新展開
【About the Role】 Join our cutting-edge team to shape the future of communication technologies. As a key member of our engineering team, you will be at the forefront of developing innovative baseband algorithms, designing robust Ethernet or PCIe/USB4 PHY systems. Your expertise will drive the creation of low-power, high-speed communication systems and advance the digital signal processing of mixed-signal systems. Additionally, you will play a pivotal role in representing our company at IEEE/OIF standard meetings, influencing the future of communication standards. With the rapid advancement of Generative AI, the demand for high-speed Serializer/Deserializer (SerDes) in data center applications is skyrocketing. This trend presents significant business opportunities, and you will be instrumental in capitalizing on these developments. 【Key Responsibilities】 1. Develop state-of-the-art baseband algorithms to enhance communication system performance. 2. Architect and design Ethernet or PCIe/USB4 PHY systems, focusing on system efficiency and reliability. 3. Lead communication system verification efforts to ensure system integrity and performance. 4. Innovate in architecture and algorithm design for low-power, high-speed communication systems. 5. Apply digital signal processing techniques to optimize mixed-signal system functionality. 6. Actively participate in IEEE/OIF standard meetings, contributing to the development of industry standards. 7. Leverage the trend of Generative AI to drive the development of high-speed SerDes solutions for data center applications.
- 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 今天剛更新展開
1. Serdes/High speed interface related PHYD IP architecture planning. 2. Serdes/High speed interface related PHYD IP RTL coding. 3. Serdes/High speed interface related PHYD IP front-end and back-end integration. 4. Co-work with MAC design team and DV team for IP verification. 5. Co-work with Analog design team for PHY co-simulation.
- 面議（經常性薪資達4萬元或以上） 新竹市東區 4年工作經驗 今天剛更新展開
•重點開發技術: 系統軟韌體開發、高速資料實體層(physical layer) 資料傳輸軟體開發、優化硬體效能及產品量產品質控管 •主要目標: 完成Enterprise/AI/xPU等相關產業客製化IC的軟韌體開發與系統整合，並協助客戶產品量產 •負責新產品的系統設計與開發，確保符合公司及客戶的需求 •協助量產過程中的技術問題解決，並提供專業建議以提升生產效率與品質 •與跨部門團隊合作，確保產品從設計到量產的順利過渡 •分析並改善現有系統和流程，以提高產品質量和生產效率 •參與產品測試和驗證，確保產品符合相關標準和規範
- 面議（經常性薪資達4萬元或以上） 新竹市東區 4年工作經驗 今天剛更新展開
1. 負責高速UCIE,SERDES相關開發, 包含架構定義, 驗證, 客戶支援(熟悉架構, 韌體、除錯、優化及測試等工作項目) 2. 透過模擬來定義架構與規格 ( Matlab ) 3. 開發測試自動化 4. 協同團隊共同完成系統雛型建立及性能優化與調適 5. 達成客戶端產品導入，並支援產品量產
- 面議（經常性薪資達4萬元或以上） 新竹市東區 4年工作經驗 今天剛更新展開
1. 熟悉 2.5D 或是 3D 封裝技術, 開發和量產經驗 2. 從系統架構優劣比較, SIPI 或是測試或是 thermal 角度來提供適合的封裝技術
- 面議（經常性薪資達4萬元或以上） 新竹市東區 5年工作經驗 今天剛更新展開
1. Develop 3.5D methodology from RTL to GDS and Package 2. Coordinate Thermal and PI/SI team to deal with high power design 3. Execute the project at different phases
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