面議(經常性薪資達4萬元或以上) 台北市南港區 工作經歷不拘 今天剛更新
1. Participate in the design and development of Base-Band or RF HW System-in-Package(SiP) modules
2. Use simulation tools such as Cadence, HFSS, Siwave and ADS for design verification and optimization
3. Electrical measurements using power supplies, oscilloscopes, VNAs, and signal generators
4. SiP module schematic design, layout planning and BOM release
5. Collaborate with packaging, layout, and process teams to evaluate the impact of SiP, fan-out, and substrate structures on electrical performance
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