-
職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 台南市新市區 2年工作經驗 今天剛更新展開
【工作說明】 1.成品庫現場管理 2.流程改善 3.稽核帶領 4.成本預算管控 【應徵條件】 1.兩年以上倉儲或出貨管理經驗 2.多益550分以上(或GEPT/雅思/托福之英文證照) 【特殊備註】 需在路竹及南科廠兩地作業
家庭日員工結婚補助生育補助社團補助員工在職教育訓練 - 面議（經常性薪資達4萬元或以上） 新竹縣竹北市 6年工作經驗 今天剛更新展開
【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ Key Responsibilities: • Lead and drive the qualification, process development, trouble-shooting, characterization of advanced chip/wafer bonding/de-bonding processes for SUSS products to ensure competitive edge of processes performance for customer demands in the domain fields of 3D advanced semiconductor, e.g. SoIC, CoWoS, InFO, BSPDN • Improve the yield of process characteristics by analyzing process symptom data and performing for expertise documentation of technique to conduct 3D processes enhancement for sophisticated technical projects and events • Act as the primary point of contact for on field key customers, manage multi-disciplinary projects and technical tasks of R&D or HVM from concept to completion, ensuring milestones on time and within planning scope • Co-worker with the team to cultivate the continuous BKM techniques knowledge stewardship, accelerating the team‘s technical proficiency • Take accountability and ownership of critical tasks and projects assigned by supervisor Requirements: • Education of Master or beyond in engineering background for Physics, Optics, Material Science, Mechanical Engineering, Electrical Engineering • 6+ years of proven experience in wafer fab working, specifically in 3D wafer process engineering or field applications • Deep technical proficiency with chip/wafer bonder/de-bonder and sophistic knowledge with 3D semiconductor or advanced packaging domains • Demonstrated experience in managing complex projects or tasks • Analytical skills, self-motivated, resilience characteristics with good accountability
全勤獎金年節獎金年終獎金三節獎金績效獎金 - 面議（經常性薪資達4萬元或以上） 台中市西屯區 3年工作經驗 今天剛更新展開
【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ - Primarily responsible for operating and supporting Photomask cleaning, developing and baking equipments. - Set up new equipments and perform final acceptance testing to ensure full compliance with customer and internal requirements. - Maintain production tools in optimal condition and troubleshoot process or equipment issues in a timely manner. - Support Continuous Improvement Projects (CIP) to enhance equipment performance and process quality. - Build and maintain strong communication and relationships with customers to support ongoing collaboration and satisfaction. - Apply in-depth knowledge of application processes and demonstrate strong skills in operating production equipment. - Continuously learn and stay updated on new products, technologies, and processes through scheduled training sessions and self-paced learning. - Attend and participate in sales meetings, product seminars, and trade shows to represent the company and enhance product knowledge. - Keep abreast of semiconductor industry trends, with a focus on photomask equipment and related applications. - Prepare and deliver clear written reports, technical presentations, and documentation to customers. - Perform additional tasks and assignments as directed by the supervisor.
全勤獎金年節獎金年終獎金三節獎金績效獎金 - 面議（經常性薪資達4萬元或以上） 新竹縣竹北市 10年工作經驗 今天剛更新展開
【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ Do you think strategically, are you interested in the dynamic market of the Semiconductor Industry and promote the success of innovative technologies? Take responsibility for the success of our products and solutions, develop sustainable strategies and promote innovative technologies in a promising market. We are looking for the next possible date Tasks: 1. Technology Scouting & Market Intelligence • Monitor industry trends and emerging technologies in semiconductor manufacturing and advanced packaging. • Identify future equipment opportunities related to: ◦ Hybrid Bonding ◦ Wafer-to-Wafer Bonding ◦ Die-to-Wafer Bonding ◦ Temporary Bonding & Debonding ◦ Advanced Packaging Lithography ◦ RDL Processing ◦ Heterogeneous Integration ◦ Chiplet Integration ◦ Silicon Photonics ◦ Co-Packaged Optics (CPO) ◦ Glass Core Packaging ◦ HBM Packaging Technologies • Analyze competitive technology developments and provide strategic recommendations. 2. Strategic Customer Engagement • Establish and maintain technical relationships with key customer engineering and technology organizations. • Support technical discussions with process integration, module engineering, R&D and advanced packaging teams. • Participate in customer technology reviews, workshops and roadmap discussions. • Serve as a trusted technical advisor to strategic customers. 3. Product & Technology Strategy • Translate customer technology requirements into actionable product development recommendations. • Support long-term product roadmap planning for: ◦ Wafer Bonding Systems ◦ Temporary Bonding & Debonding Platforms ◦ Hybrid Bonding Solutions ◦ Advanced Packaging Lithography Systems ◦ Large Field Exposure Technologies • Identify technology gaps and future investment opportunities. 4. Competitive Intelligence • Monitor competitive activities, product launches and technology roadmaps. • Benchmark competitor solutions and identify differentiation opportunities. • Deliver regular market and technology assessment reports. 5. Business Development Support • Support strategic account planning and opportunity development. • Prepare technical presentations, technology assessments and business case evaluations. • Support major customer pursuits and technology evaluations. 6. Industry Engagement • Represent the company at major industry conferences and technical forums. • Build relationships with semiconductor research institutes, industry organizations and ecosystem partners. • Maintain awareness of emerging technology developments across the semiconductor industry.
全勤獎金年節獎金年終獎金三節獎金績效獎金 - 面議（經常性薪資達4萬元或以上） 新竹縣竹北市 6年工作經驗 今天剛更新展開
The R&D Manager (Hardware) is responsible for leading the hardware development team in the design and enhancement of semiconductor process equipment. This role focuses on mechanical, electrical, and system integration aspects, ensuring product quality, manufacturability, and performance while collaborating closely with software and process engineering teams. Key Responsibilities • Lead the hardware R&D team in developing new semiconductor equipment and improving existing systems, covering mechanical, electrical, and system integration design. • Define hardware architecture, development roadmaps, and engineering priorities in alignment with product and business strategies. • Supervise mechanical and electrical design reviews, prototyping, and validation to ensure reliability and performance targets are met. • Collaborate cross-functionally with software, manufacturing, process, and service teams to ensure seamless product integration and transfer to production. • Evaluate and adopt advanced technologies to enhance equipment precision, stability, and cost efficiency. • Manage project schedules, resource allocation, and technical documentation throughout the development lifecycle. • Drive continuous improvement in design quality, standardization, and modularization. • Coach and develop engineers, fostering technical growth and a culture of accountability and innovation.
全勤獎金年節獎金年終獎金三節獎金績效獎金 - 面議（經常性薪資達4萬元或以上） 新竹市東區 3年工作經驗 今天剛更新展開
• 工作項目： 1.新聞稿與官方 Blog 撰寫： 重要產品發表、公關新聞稿與官方 Blog 專題，並導入 SEO/AEO觀念優化內容曝光。 2.媒體經營與輿情監測： 建立並維繫科技/財經核心媒體關係，統籌媒體採訪接待、問答統整及新聞輿情追蹤。 3.公關專案與活動執行： 協助各類公關活動企劃與現場執行。 4.企業官網內容維護與優化： 定期更新與優化官網文案（產品/企業訊息），提升品牌專業形象與數位搜尋能見度。 • 需求條件： 1. 具備 3 年以上企業公關、公關代理商或數位公關相關經驗。 2. 扎實的中英文商務撰寫與高階溝通協調能力。 3. 熟悉媒體運作，且具備現代 SEO 語意優化或 AEO 數位傳播概念。 4. 具科技業（B2B/Tech）、上市公司PR/Communications經驗者優先 。
伙食津貼員工停車位或停車補助員工健身房員工餐廳按摩室 - 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 今天剛更新展開
應徵條件： 1. 瑞昱強力招募(1)116年度研發替代役及(2)預聘116年應屆畢業之碩士、博士生。 2. 碩士以上之電子、電機、電信、電控、資工等相關科系。 3. 具備下列任一條件者佳： a. 熟 C、C++、Assembly、Linux、SPICE、Matlab、Cadence EDA 環境。 b. 熟類比電路設計、數位信號處理及有興趣者。 c. 對 PAM4 SerDes (112G/224G)、Optical PHY、車用電子 (Automotive IO/Gateway) 開發有興趣者。 d. 具 ADC、PLL、高速 Crypto 相關經驗及有興趣者。 e. 對通訊網路、聯網多媒體、電腦週邊、智慧互聯產品或程式設計有濃厚興趣者。
伙食津貼員工停車位或停車補助員工健身房員工餐廳按摩室 - 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 今天剛更新展開
應徵條件： 1. 瑞昱強力招募(1)116年度研發替代役及(2)預聘116年應屆畢業之碩士、博士生。 2. 碩士以上之電子、電機、資工、資科等相關科系 3. 具備以下任一條件者尤佳： a. 具備運用相關專業 tools 能力：C/C++/Python/Java, PyTorch/TensorFlow, ARM & RISC-V Assembly/Intrinsic/SIMD。 b. 數位語音或影像處理相關知識，熟悉 AI ISP 演算法 (AINR / Embedded AI) 開發。 c. 對 AI 代理駕馭 (AI Agent for Autonomous Driving) 前瞻技術有熱忱。 d. 熟悉 LLVM compiler、Inference Engine Optimization 或 AI/ML/DSP 應用相關技術。
伙食津貼員工停車位或停車補助員工健身房員工餐廳按摩室 - 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 今天剛更新展開
應徵條件： 1. 瑞昱強力招募(1)116年度研發替代役及(2)預聘116年應屆畢業之碩士、博士生。 2. 碩士以上；電機、資訊等相關科系，並具下列任一條件者佳： a. 熟悉Verilog RTL、Synthesis、Simulation、Timing Analysis 等相關 IC Design Flow及有興趣者。 b. 熟悉 Design for Testability 技術，包含 Scan / ATPG、Delay Test、Memory BIST、Boundary Scan、Diagnosis 等及有興趣者。 c. 有 DFT Tools (如 DFT Compiler、TetraMAX、BSD Compiler、FastScan、TestKompress、MBISTArchitect) 使用經驗及有興趣者。 d. 積極負責、勇於迎接挑戰，對於 Nanometer / SoC DFT Implementation、開發及推廣設計流程有興趣者。
伙食津貼員工停車位或停車補助員工健身房員工餐廳按摩室 - 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 今天剛更新展開
應徵條件： 1. 瑞昱強力招募(1)116年度研發替代役及(2)預聘116年應屆畢業之碩士、博士生。 2. 碩士以上之電子、電機、電信、電控、資工及通信等相關科系，並具下列任一條件者佳： a. 熟悉CMOS元件特性。 b. 熟悉SRAM/其他記憶元件特性。 c. 熟悉Hspice, Hsim等simulation tool, Virtuso, Laker等layout tool. d. 對SRAM/其他記憶體電路設計、測試與生產有興趣者。
伙食津貼員工停車位或停車補助員工健身房員工餐廳按摩室 - 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 今天剛更新展開
應徵條件： 1. 瑞昱強力招募(1)116年度研發替代役及(2)預聘116年應屆畢業之碩士、博士生。 2. 碩士以上之電子、電機、電信、電控、資工、資科等相關科系，並具備下列任一條件者佳： a. 熟悉 C/C++、硬體描述語言 (Verilog) 和驗證語言 (Vera/systemVerilog)。 b. 具 IC 設計經驗者佳。 c. 對晶片設計驗證或程式設計有濃厚興趣者。
伙食津貼員工停車位或停車補助員工健身房員工餐廳按摩室 - 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 今天剛更新展開
應徵條件： 1. 瑞昱強力招募(1)116年度研發替代役及(2)預聘116年應屆畢業之碩士、博士生。 2. 碩士以上之電子、電機、電信等相關科系，並具備下列任一條件者佳： a. 對 RF IC 設計有興趣者。 b. 熟 CMOS/SiGe RF 設計及通訊系統經驗尤佳。
伙食津貼員工停車位或停車補助員工健身房員工餐廳按摩室 - 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 今天剛更新展開
應徵條件： 1. 瑞昱強力招募(1)116年度研發替代役及(2)預聘116年應屆畢業之碩士、博士生。 2. 碩士以上之電子、電機、電信、電控等相關科系，並具備下列任一條件者佳： a. 熟悉相關 tools (Astro, Encounter, IC Compiler) 者。 b. 熟悉 IC 後段設計流程, 具相關 APR 經驗及有興趣者。 c. 對於開發及推廣 Physical Design Flow 有興趣者。 d. 具程式設計 (TCL, Perl, C/C++) 能力者佳。
伙食津貼員工停車位或停車補助員工健身房員工餐廳按摩室 - 月薪40000~50000元 新竹縣竹北市 工作經歷不拘 今天剛更新展開
1. 化學品供應系統工程施作 2. 氬焊與自動焊機操作學習 3. 配合現場工程需求支援工程監工作業 4. 其他主管交辦事項
生育補助員工及眷屬喪葬補助壽險員工團保眷屬團保 -
