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    Job Responsibilities - To be the owner for manufacturing test on the released products. - Responsible for test program introduce to mass production - Responsible for NPI (after R-gate released) test data analysis and feedback to BL/PETE if any improvement needed - To be the owner for duplicated test hardware by performing debug and qualification, MSC (Gage R&R) analysis and release report - Responsible for 1st line hold lot disposition, including low yield, QA fail .......etc - To initial and work with related process owners on testing processes, documentation, and best practices - Participate in or drive test automation initiatives when applicable Required Qualifications - 3+ years of experience as a Test Engineer - Solid understanding of software/system testing methodologies - Familiarity with Linux environments and command-line operations - Experience with machine language (e.g., Java, C++) - Experience in system, embedded, hardware, or manufacturing testing - Strong analytical and problem-solving skills - Strong sense of ownership and responsibility for product quality English communication, reading, writing
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  • 月薪50000元 台北市大同區 工作經歷不拘 1天前更新
    我們是一家專注於社區管理服務的公司,致力於為住戶提供高品質的生活環境與專業服務,服務客群為住宅社區住戶及管委會。我們秉持責任感與專業精神,為社區運作提供全面支持。 1. 確保落實執行社區規約及管理辦法,維護社區正常運作。 2. 召開管委會定期會議,負責會議資料準備及紀錄。 3. 負責社區決議事項的推動與執行。 4. 規劃及監督社區清潔、警衛、設施設備維修等日常管理工作。 5. 管控及審核社區財務與預算,確保財務透明和穩健。 6. 監督環境清潔、維修及公共設施保養工作,確保住戶滿意。 7. 協調社區住戶與管委會之間的溝通,促進良好社區氛圍。 8. 危機處理與應急管理,迅速應對社區突發事件。 歡迎您加入我們!如果您對社區管理充滿熱情,擁有良好的管理能力及責任感,我們誠摯邀請您成為我們團隊的一員,與我們一同為住戶創造更優質的生活環境。期待您的履歷!
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  • 面議(經常性薪資達4萬元或以上) 高雄市楠梓區 3年工作經驗 1天前更新
    Job Description 1. Ensure high-quality and accurate implementation Responsible for FDC/ADC model setup based on solid process knowledge and failure analysis experience, ensuring model accuracy and minimizing rework. 2. Manage and reduce configuration risks Configure monitoring logic, thresholds, and rules to effectively distinguish true signals from noise, reducing false alarms and missed detections that may impact production. 3. Drive efficient project execution Ramp up on systems and processes, minimizing trial-and-error to ensure timely and effective implementation of FDC/ADC projects. 4. Collaborate across cross-functional teams Work closely with Process, Equipment, Manufacturing, and IT teams to align objectives, communicate technical insights, and drive decisions efficiently. 5. Support yield improvement and operational performance Leverage monitoring systems to enable actionable insights that contribute to quality improvement, yield enhancement, and manufacturing efficiency. 6. Ensure project continuity and long-term ownership Demonstrate strong role clarity and accountability, supporting stable system operation, continuous improvement, and sustained project ownership. Requirements: Basic Qualifications: - At least 2 years of working experience in semiconductor manufacturing, preferably as a Die Attach Process Engineer. - Master‘s degree or above in engineering-related disciplines, such as Electrical Engineering, Mechanical Engineering, Materials Science, or Chemical Engineering. Technical and Analytical Skills: - Solid knowledge of process control, yield analysis, defect reduction, and continuous improvement methodologies. - Candidates with a statistics-related background are preferred, with the ability to apply data analysis techniques to process monitoring and improvement (e.g. SPC, Cp/Cpk, GR&R, MSA). - Hands-on experience with FDC (Fault Detection & Classification) and ADC (Automatic Defect Classification) applications, capable of utilizing process and equipment data for abnormal detection, trend monitoring, and early warning. - Experience in process automation applications, able to support system- or equipment-level automation projects to enhance process control and reduce manual operation risks. Quality and Customer Interface Experience: - Experience in customer complaint handling and root cause analysis, familiar with structured problem-solving methodologies such as 8D, 5 Why. - Ability to work effectively with cross-functional teams (Process, Quality, Equipment, and Suppliers) to drive corrective and preventive actions. Communication Skills: - Good written and verbal English communication skills, capable of effective interaction with customers, suppliers, and internal teams. - English proficiency equivalent to TOEIC 600 or above. Systems and Manufacturing Knowledge - Ability to leverage system and automation data for process tracking, lot history review, abnormal analysis, and continuous improvement activities.
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    分紅入股年終獎金三節獎金激勵獎金員工團保
  • 面議(經常性薪資達4萬元或以上) 高雄市楠梓區 5年工作經驗 1天前更新
    Job Description - Ensure compliance with Taiwan electrical regulations, SEMI standards, and safety codes. - Manage and maintain facility electrical systems, including: High/low voltage distribution (HV/LV), Switchgear, transformers, UPS, and generators. - Proficient in AutoCAD for electrical drawings and single line diagrams - Strong knowledge of high-voltage power systems, including: Protective relay operation, Single line diagram development and interpretation, Familiar with motor control systems. - Handle emergency response for power-related incidents and recovery planning. - Ensure power reliability and quality to support critical manufacturing tools - Monitor and improve system performance, capacity, and efficiency. - Lead preventive maintenance (PM), especially annual electricals PM activity and troubleshooting for power systems. - Coordinate power system upgrades, expansions, and projects - Support new tool installation(Hook-up) and capacity ramp-up planning. - Analyze power consumption and drive energy-saving initiatives. Qualifications: - Bachelor‘s degree or above, preferable in Electrical Engineering - At least 5+ years of experience in industrial or semiconductor facilities. - Relevant certifications is a plus. (Electrical Engineer license, HV certification, etc.) - Familiar with PLC operation and basic control logic is a plus. - Experience in Energy Management Systems (EMS), such as ISO 50001, and HVAC systems is a plus.
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    分紅入股年終獎金三節獎金激勵獎金員工團保
  • 面議(經常性薪資達4萬元或以上) 雲林縣褒忠鄉 1年工作經驗 今天剛更新
    1.產品可行性評估。 2.產品設計開發專案管理。 3.醫療器材技術文件撰寫。 4.設計開發查證與確效。 5.協助準備法規審查資料文件。 6.設計變更專案執行。 7.產品改良專案執行。 8.熟3D(Solidworks)/2D(CAD)繪圖軟體。 9.諳專利檢索與特徵分析鑑別新產品專利與規格資訊。 10.需不定期出差
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  • 面議(經常性薪資達4萬元或以上) 高雄市楠梓區 工作經歷不拘 1天前更新
    Job Description - Main contact window with business lines (BLs) to deliver a high quality and manufacturable product for IC test production, meeting or exceeding the required time to market or product cost. - Take lead of new product introduction (NPI) for IC test - To coordinate with related BLs (business line) and align with wafer/final test factories to prepare the product transfer - To improve new product introduction procedure to enable smooth product transfer - To reduce risk and impact to customers and factories, escalation management, e.g. reduce risk and impact by right and timely escalation - To ensure no gap on test tooling availability Facilitate IC test data review and process for planning forecast, take responsibility on test technical data (and improvement plan) in time and accuracy - To follow up test improvement projects, hold lots, progress of New Product Introduction, test buy off…etc. - Process of Test Engineering Notice and Enovia ECO Requirement - Bachelor degree (or above), Engineering background is preferred. - Excellent communication skills (English/Mandarin, TOEIC>600) - Good logic thinking - Be familiar with MS Office tool - 1 yrs experience in IC testing or related working experience is preferred
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    分紅入股年終獎金三節獎金激勵獎金員工團保
  • 面議(經常性薪資達4萬元或以上) 台北市大安區 工作經歷不拘 1天前更新
    臺北市立聯合醫院仁愛院區一般內科招募約用住院醫師招募公告 一、職稱:約用住院醫師(占訓練容額) 二、名額:正取2名,備取4名。 三、報名資格: (一)具中華民國國籍並領有國民身分證(大陸籍人士需來臺設籍10年以上),且無公務人員任用法第28條第1項、臺灣地區與大陸地區人民關係條例第21條第1項及第9-1條規定情形;不得於中國大陸設有戶籍、不領用中國大陸之護照、身分證、定居證、居住證及其他依相關法令或經行政院、大陸委員會禁止領用之中國大陸身分證件。 (二)學經歷:國內外經教育部認可之醫學系、中醫學系選醫學系雙主修畢業。 (三)領有本國醫師證書及考試及格證書。 (四)完成PGY訓練(尚未完訓者,報名時檢附PGY在職證明並註明擬結訓日期)。 (五)本職缺適用勞動基準法第84條之1,應於報到前簽訂約定書並完成核備。 四、甄試方式:面試30%、專業測驗(筆試)70%,總分80分以上為錄取標準。 五、工作項目: (一)一般內科醫療業務。 (二)需輪值平日及假日值班。 (三)其他交辦事項。 六、工作地點: 臺北市立聯合醫院仁愛院區,10629臺北市大安區仁愛路四段10號。 本院為無菸無檳職場 七、聯絡方式:臺北市立聯合醫院仁愛院區內科部,聯絡電話:27093600分機1266。 八、報名方式: (一)即日起至115年6月17日17:00止,請至臺北市立聯合醫院網站「人才招募專區/一般人才招募/徵才公告」網路報名(請務必自行確認報名成功,否則一律視同未報名),並自行列印甄試報名表並檢附相關證件,以親送或限時掛號郵寄(10851)臺北市萬華區艋舺大道101號11樓,臺北市立聯合醫院人事室二股李小姐收,以限時掛號郵戳為憑(臺北市新北市以外地區請務必自行預留郵件送達時間)。信封請註明應徵科室、職稱及寄件人姓名,且確實勾選必備資料(依實際收件證件資料為準)。 (二)應繳證件:必備證件 1.甄試報名表(請至臺北市立聯合醫院網站「人才招募專區/一般人才招募/徵才公告」網 路報名,自行列印甄試報名表並留白天聯絡電話、電子郵件信箱、黏貼2吋照片1張)、 自傳各1份。 2.身分證正反面影本1份(出生地為大陸地區者,應檢附戶籍謄本)。 3.國內外經教育部認可之醫學系、中醫學系雙主修醫學系畢業證書影本1份。 4.醫師證書影本1份。 5.考試及格證書影本。 6.PGY在職證明影本、離職證明或PGY結訓證明書影本1份。 (離職證明需註明起迄始日期,在職證明需註明擬結訓日期) (三)注意事項: 1.持外國學、經歷證明者,需附我國駐外單位認證文件。持本國學歷結業證明者,須另附 教育主管機關核發之資格證明書。 2.未註明應試類科、未貼妥照片、未填寫自傳、應備文件若有資料不全、未附或資格條件 不符者,即視為資格審查不合格,不得以任何理由要求補附文件、退件或及變更報考 類科。 3.報名所繳資料恕不退件,如需返還書面應徵資料,請附回郵信封俾利郵寄。 4.報名表所填具之電子郵件信箱、通訊地址、聯絡電話等資料有異動者,請以E-mail通知 本院並同時來電確認,以維護錄取人員權益。 5.資料逾期、遺漏、提供不實或偽造變造者,視為資格不合格;所填資料或繳交證明文件 於錄取後發現係屬不實或有偽造、變造情事者,撤銷錄取資格。 6.參加甄試人員及錄取人員逾通知甄試時間、報到期限而未參加甄試或報到者,視為放 棄,並註銷其資格,不得以任何理由請求保留。 7.倘為軍公教退休人員者,請於經歷欄敘明「退休機關及日期」;另公務機構退休人員, 請依公務人員退休資遣撫卹法第77條規定自行衡酌權益事宜。 8.錄取後發現未符合醫事人員執業登記及繼續教育辦法之執業登記規定,致不能辦理執業 登記,或有公務人員任用法第28條第1項、臺灣地區與大陸地區人民關係條例第21條第 1項規定情形者,本院應予終止契約。 9.錄取後如有違反臺灣地區與大陸地區人民關係條例第9-1條規定情形,於中國大陸設有 戶籍、不領用中國大陸之護照、身分證、定居證、居住證及其他依相關法令或經行政 院、大陸委員會禁止領用之中國大陸身分證件者,於到職日前應辦理註銷。 10.依本院約用醫師管理要點肆、二十三、(五)之規定,不得兼任本院以外之工作,但 「公務員服務法」允許者不在此限,惟應事前報經院長核准。 11.本職缺適用勞動基準法,錄取人員應於報到前簽訂「適用勞動基準法第84條之1約定 書」,並經本府勞動局核備後始得辦理報到。 (四)放榜地點: 請自行至臺北市立聯合醫院網站「人才招募專區/一般人才招募/錄取公告」查詢。 (五)甄試訊息: 臺北市立聯合醫院網站「人才招募專區/一般人才招募/初審公告」查詢(或洽聯絡人確 認)。 (六)備註: 1.待遇:依「臺北市立聯合醫院約用醫師管理要點」及「臺北市政府衛生局所屬醫療機構 人員獎勵金發給基準」辦理。 2.錄取人員應持合格體檢報告(3 個月內有效期)始得完成報到手續(相關疑問請洽院本 部職業安全衛生室電話:2555-3000分機2569)。
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  • 面議(經常性薪資達4萬元或以上) 台北市南港區 2年工作經驗 1天前更新
    一、工作內容 想找一份穩定、單純、環境佳的工作嗎? 我們正在招募 外商公司櫃台人員,適合喜歡接待、行政支援, 並具備基本英文溝通能力的你。 .櫃台接待(含訪客/識別證/停車位/Locker/遺失物/郵務管理等) .協助各節慶辦公室佈置 .資產管理與盤點 .部門文件、檔案、資料維護及管理 .ESG相關活動、節慶相關活動主導或協助,與其他部門合作,例如會議、活動、訓練等 .辦公室設施設備及環境維護管理,庶務相關備品管理及採購 .其他主管交辦事項 二、時間:08:00-17:00 三、休假:週休二日,國定假日休 四、薪資:面議 五、福利 .勞保、健保 .年節獎金或禮券 .結婚補助金與結婚禮金 .生育補助金 .年終獎金 .公司負擔6﹪退休金 .健康檢查 .提供制服、不押保證金 .提供專業教育訓練及核發證照 . 完整的人事管理與升遷制度
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  • 月薪55000元 桃園市桃園區 5年工作經驗 1天前更新
    1. 負責空調工程圖面繪製、修改及套圖作業。 2. 協助業主溝通、詢價作業及文書報表整理。 3. 執行設計圖、施工圖、竣工圖之檢視、修改與圖面清點。 4. 其他主管交辦事項。
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  • 面議(經常性薪資達4萬元或以上) 新竹市東區 5年工作經驗 1天前更新
    Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/APAC-Foundry-Operations-Senior-Principal-Engineer_R-10062827 Job Description The APAC Foundry Operation team works with foundry partners on technologies which are evaluated and/or subjected to production. The key areas of responsibility of the jobholder are: - Lead the release and transfer of process options at foundries. - Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process - Lead and steer the projects towards timely completion to support NXP business needs. - Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc. The requirement fulfilling the job: - Bachelor or MSc in physics, material engineering or electrical engineering. In-depth knowledge of semiconductor physics, process development and manufacturing. - >10 years of experience with semiconductor process integration, working in foundries’ production or development teams. - Hands on experience in being a lead; leading teams with responsibilities in development, transfer or production projects. - All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead. - Good communication skills. - Pro-active working attitude, creative, pragmatic, enterprising and result driven. - Having the ability to influence and steer a discussion. - Familiar in managing/working with foundries, maximizing leverage from foundries.
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    分紅入股年終獎金三節獎金激勵獎金員工團保
  • 面議(經常性薪資達4萬元或以上) 新竹縣竹北市 工作經歷不拘 1天前更新
    Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.
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    分紅入股年終獎金三節獎金激勵獎金員工團保
  • 月薪55000元 桃園市桃園區 5年工作經驗 1天前更新
    1. 負責機電施工圖繪製、修改及套圖作業。 2. 協助業主溝通、詢價作業及文書報表整理。 3. 執行設計圖、施工圖、竣工圖之檢視、修改與圖面清點。 4. 其他主管交辦事項。
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  • 月薪42000~45000元 高雄市楠梓區 工作經歷不拘 1天前更新
    Wire Bond 製程助理工程師工作內容: 1. 協助進行基本統計分析(如平均值、趨勢圖、良率統計等),並製作簡易報表。 2. 協助異常產品之初步處理與分析,包含資料整理、產品追蹤。 3. 支援製程工程師進行實驗(DOE)或製程改善相關之資料準備工作。 4. 協助維護製程文件、SOP 及相關記錄之更新。 5. 其他主管交辦之製程支援事項。 Wire Bond 助理工程師協助製程工程師進行日常製程支援相關工作,包含樣品(sample)收集、製程資料彙整、文書作業及基本統計分析,確保製程資料完整性與準確性,並支援製程改善與量產穩定。 本職位對公司業務發展具有重要意義,為公司製程、設備及產品品質提供技術支持。未來在半導體行業中擁有廣泛的發展前景。 歡迎符合上述資格的求職者申請本職位,並表達您對本職位的興趣。
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