面議(經常性薪資達4萬元或以上) 東南亞馬來西亞 1年工作經驗 1天前更新
【工作職務與內容】
1. Bumping Equipment Engineer
• Equipment breakdown repair and regular maintenance.
• Improvement of equipment issues and analysis and tracking of abnormalities.
• Effectively control equipment maintenance costs.
2. Bumping Integration Engineer
• AOI Inspection Capability Enhancement
• Yield Analysis and Improvement
• SPC (Statistical Process Control) Management and Maintenance
• Automation Project Implementation
• EDA and Intelligent Analysis System Development
3. Bumping Production Engineer
• Production Scheduling and Output Control.
• Production Efficiency, Quality Improvement, and Project Management.
• Production Tooling and Material Management & Maintenance.
• Manufacturing Systems Maintenance and Production Report Analysis
• TA Training Arrangement, Evaluation, and SOP Management.
4. Bumping Process Engineer
• More than one year of experience in semiconductor backend packaging (Bumping).
• Work experience related to chemical analysis.
• Educational background in materials science, chemistry, chemical engineering, or related engineering/science fields.
【具備技能】
1. PHOTO Equipment、Wet bench Equipment related experience
1. Semiconductor equipment/Manufacturing related experience
2. Bumping process related experience
3. Sputter, photo, plating, and etching operations related experience
4. Data analysis tools & Programming skills (e.g., Python, SQL, or Excel VBA)
【經驗條件】
1. More than one year of experience in bumping process
2. More than one year of experience in semiconductor manufacturing processes
【薪資說明】
◎依學經歷、科系、經驗相關性及專長等條件,以及馬來西亞子公司核敘個人薪資。
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