-
職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 2天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22575&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development. productivity/quality. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 月薪50000~65000元 台南市新市區 工作經歷不拘 2天前更新展開
1.定期維護、保養生產設備機台 2.生產機台故障排除及異常查修 3.設備問題改善及異常分析與追蹤處理 4.維持生產機台設備的正常運轉 ※ 無經驗可(完整在職訓練) 薪資條件： 工作20天(含5天加班天) 早班50,000~55,000元(含早班津貼及加班費) 夜班60,000~65,000元(含晚班津貼及加班費) *高雄南科廠正式生產前，將先於高雄楠梓廠訓練，之後再依照南科廠產能作調動。
國外旅遊員工聚餐慶生會尾牙自強活動 - 面議（經常性薪資達4萬元或以上） 新北市五股區 2年工作經驗 2天前更新展開
📢 徵才｜機械設備繪圖員 職務名稱： 機械設備繪圖員 工作內容 機械設備圖面繪製與修改 CAD圖面製作及校對 配合工程需求完成設計圖面 主管交辦事項 應徵條件 ✔ 具機械設備繪圖相關工作經驗 ✔ 熟悉 AutoCAD（CAD）繪圖軟體操作 ✔ 具相關繪圖或技術證照者佳 ✔ 工作細心、具責任感，能獨立作業 薪資待遇 面議（依工作經驗及能力敘薪） 工作地點 新北市五股區民義路2段35-3號 上班時間 早上8:00-下午5:00，中午休息一小時。 福利制度 勞健保、年終獎金、三節禮金、供餐。 歡迎具備相關經驗者加入我們的團隊！
全勤獎金年節獎金意外險員工團保員工宿舍 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 2天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22574&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : Come and join an innovative and challenging team, where groundbreaking ideas shape the future of semiconductor technology. As an R&D Engineer, you will work on advanced technology development, such as exploratory research in advanced device architectures, device and process integration for manufacturability, advanced module process development, as well as the evaluation of novel materials, equipment, and processes. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration For Device Engineers: (1) Transistor Architecture & Design: Pioneering device design for advanced nodes. (2) Advanced Characterization: Defining the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting bench electrical measurements (I-V, C-V). (3) Simulation & Modeling: Utilizing TCAD (Technology Computer-Aided Design) and HSPICE to simulate device characteristics, optimize performance, and fortify model integrity. (4) Test Key Design: Crafting precision test key designs to facilitate accurate electrical modeling, design rule validation, and comprehensive device characterization. (5) Customer design enablement: Providing SPICE Model. For Integration Engineers (or Process Integration Engineers) : (1) Process Flow Integration: Integrating devices across various process modules (Lithography, Etch, Thin Films/Epi, Diffusion, CMP) to build a robust, manufacturable baseline for yield and device learning. (2) Experimentation & Lot Handling: Designing advanced Experiments (DOE) to meet device KPIs. Periodically serving as the on-duty engineer to coordinate and handle device lots in the R&D fab. (3) Yield & Reliability Learning: Conducting big data analysis (using JMP, Python, or custom iEDA tools) to identify process design weaknesses, hardware issues, or yield detractors. (4) Technology Transfer: Transitioning the proven, optimized advanced integration baseline process from the R&D phase to fab for high-volume manufacturing. 3. Module R&D Engineer (1) Pioneer Next-Generation Technologies: Research and develop advanced processes, novel materials, next-generation tooling, and cutting-edge computational/simulation methodologies for leading-edge semiconductor nodes. (2) Drive High-Impact Innovation: Deliver highly manufacturable, stable, and cost-effective process technologies. Optimize device physics and performance to meet stringent yield, reliability, and qualification standards. (3) Bridge Lab-to-Fab Scaling: Lead the technology transfer of advanced processes and hardware solutions from R&D phase to High-Volume Manufacturing (HVM) fabs, witnessing your research scale into global production. 4. R&D Process Center (1) PE: Develop advanced module process, optimizing stability and manufacturability to ensure high yield and reliability. Transfer processes and tools to volume manufacturing while collaborating with cross-functional teams and external suppliers to drive leading-edge module integration. Additionally, manage day-to-day operations, troubleshoot equipment, and mentor technicians to sustain operational excellence. (2) EE: Manage advanced semiconductor equipment (Diffusion, Thin Film, Lithography, or Etching) by performing warm-ups, troubleshooting, and efficiency enhancements. Plan and execute defect detection projects to analyze performance while collaborating closely with cross-functional engineers and vendors to ensure optimal equipment productivity and stability. (3) MFG: Oversee daily IC foundry operations, managing work schedules, direct labor, and cross-functional collaboration (PE/PIE/EQ) to ensure consistent service delivery. Drive productivity, manage multiple projects with overlapping deadlines, and analyze data to keep operations running smoothly. Additionally, contribute to process improvements and maintain robotic/detection systems to meet customer and business objectives.
- 月薪42000元 台中市西區 工作經歷不拘 2天前更新展開
排班輪休制，工作細心負責，需有社區密經驗。 歡迎有自信心，企圖心的優秀的你加入我們的團隊。 1.傳達上級命令以及希望達成的目標給基層員工。 2.監督基層員工工作情形。 3.教導基層員工給予基層員工需要協助。 4.人事排班調度。 5.人事聘任、留任…等人事管理。
需穿著員工制服員工在職教育訓練良好升遷制度員工生日禮金績效獎金 - 月薪42000元 台中市西屯區 工作經歷不拘 2天前更新展開
1.執行理事會之決議 2.聘僱與解聘所屬員工 3.指揮監督所屬員工推行會務與業務 4.訓練、考核、獎懲所屬員工
需穿著員工制服員工在職教育訓練良好升遷制度員工生日禮金績效獎金 - 月薪46000元 台中市后里區 工作經歷不拘 2天前更新展開
1. 條線廠【RSB整備員】技術員 主要職務： ※ 精密軋延機組輥。 ※ 出入口整備。 ※ 輥環車削。 ※ 機台整修等。 2. 本公司有一貫培訓教育機制，操作與維護工作均有輪調機制。 –––––––––––––––––––– ▲ 操作維修技術性質，具CNC工具機相關經驗者佳。 ▲ 需配合［輪班排休］，常態性早、中、晚班輪。 ▲ 輪班津貼/加班費 另計。
社團補助需穿著員工制服員工在職教育訓練良好升遷制度員工（調職）搬家安家費 - 月薪46000~49000元 台中市西屯區 工作經歷不拘 今天剛更新展開
工作內容： (一)、具主動、機警、應變及處置之能力。 A.飯店式迎賓服務 B.門禁安全管理 C.來賓訪客接待 D.車輛進出引導(主動、積極、有責任感及服務熱忱) (二)、大樓管理、防竊作業及處理工作等安全維護工作。 (三)、確保社區住戶及設施之安全，執行警衛勤務 。 (四)、 社區駐點，二班制(12H)，不輪班。 (五)、固定- 日班：07:00~19:00 二、薪資： 1. 月休8日，薪資NT$46,000~NT$49,000。 三、公司保障及福利 1.勞保、健保 2.員工團保 3.勞退提撥公司負擔6﹪退休金 4.生日禮金、生育、婚喪補助金 5.績效獎金，年節獎金或禮券 6.介紹獎金，開發獎金，穩場獎金 四、提供專業在職教育訓練 1.人員派駐前完成專業職前訓練。 2.每年定期調訓所有駐點每位同仁，並安排相關專業人士擔任講師。 3.特勤人員一年最少需受訓48小時以上。
員工團保產假勞保健保勞退提繳金 - 月薪45000元 台中市西屯區 工作經歷不拘 2天前更新展開
固定班不換點每日12H，可立即上班。 執勤內容: 1.酒店門禁管制、訪客接待。 2.查看警報器並且調查引起警鈴的原因。 3.環境安全維護管理、保障客戶生命和財產安全。 4.由監視器畫面監看出入份子，以確保建築物安全。 5.巡邏建築物與周遭環境，留意可疑線索，確保門窗安全。
需穿著員工制服員工在職教育訓練良好升遷制度員工生日禮金績效獎金 - 月薪42000元 台中市西區 工作經歷不拘 2天前更新展開
可立即上班，固定班不換點每日12H，無經驗亦可加入。 為避免耽誤雙方時間，應聘者請先致電預約面試時間。 歡迎有自信，企圖心的優秀朋友加入我們的菁英團隊。 執勤內容: 1.監看中央監控設備。 2.停車場管理與交通指揮。 3.門禁管制，維護案場安全。
需穿著員工制服員工在職教育訓練良好升遷制度員工生日禮金績效獎金 - 月薪40000元 台中市南屯區 工作經歷不拘 2天前更新展開
無經驗亦可加入。 固定班不換點每日12H，可立即上班。 執勤內容: 1.大樓門禁管制、訪客接待。 2.基本收發包裹、信件、快遞。 3.收取管理費、汽機車月租費。 4.查看警報器並且調查引起警鈴的原因。 5.環境安全維護管理、保障客戶生命和財產安全。 6.由監視器畫面監看出入份子，以確保建築物安全。 7.巡邏建築物與周遭環境，留意可疑線索，確保門窗安全。
需穿著員工制服員工在職教育訓練良好升遷制度員工生日禮金績效獎金 - 月薪42000元 台中市西屯區 工作經歷不拘 2天前更新展開
無經驗亦可加入。 固定班不換點每日12H，可立即上班。 執勤內容: 1.大樓門禁管制、訪客接待。 2.基本收發包裹、信件、快遞。 3.收取管理費、汽機車月租費。 4.查看警報器並且調查引起警鈴的原因。 5.環境安全維護管理、保障客戶生命和財產安全。 6.由監視器畫面監看出入份子，以確保建築物安全。 7.巡邏建築物與周遭環境，留意可疑線索，確保門窗安全。
需穿著員工制服員工在職教育訓練良好升遷制度員工生日禮金績效獎金 - 月薪40000元 台中市北屯區 工作經歷不拘 2天前更新展開
無經驗亦可加入。 固定班不換點每日12H，可立即上班。 執勤內容: 1.大樓門禁管制、訪客接待。 2.基本收發包裹、信件、快遞。 3.收取管理費、汽機車月租費。 4.查看警報器並且調查引起警鈴的原因。 5.環境安全維護管理、保障客戶生命和財產安全。 6.由監視器畫面監看出入份子，以確保建築物安全。 7.巡邏建築物與周遭環境，留意可疑線索，確保門窗安全。
需穿著員工制服員工在職教育訓練良好升遷制度員工生日禮金績效獎金 - 月薪40000元 東北亞日本 工作經歷不拘 2天前更新展開
須配合無塵室環境並接受派駐日本。 🎯【(台積電-日本廠)】現在招募超凡工程師！ 對半導體技術有熱情，並想投身於尖端科技的世界嗎？我們正邀請你加入，與我們共同創造科技新未來！🌟 💼 加入我們，挑戰以下精彩任務： 1. 開發與優化半導體製程技術，涵蓋製造工藝設計、數據分析及新產品製程導入。 2. 運用你的技能設定與操作半導體製程設備，並進行數據分析與提升改進。 3. 執行日常設備維護與故障排除，確保設備穩定運行與技術升級。 4. 規劃與設計半導體晶片規格，同時參與IP演算法及數位模組的設計研發。 5. 測試半導體元件及積體電路，熟悉測試設備操作與日常維護。 6. 撰寫技術文件與專利申請，保持與市場趨勢同步的技術知識更新。 7. 支援無塵室設備日常維護，制訂並落實設備保養計畫，以維持生產穩定性與高良率。 🚀 加入我們，你將有機會參與尖端半導體技術的創造，真正改變未來科技版圖！ 準備好讓你的專業閃耀國際舞台了嗎？立即投遞履歷，一起開啟科技的無限可能吧！🎉
全勤獎金年節獎金年終獎金三節獎金意外險 -
