面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 4天前更新
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https://careers.tsmc.com/careers/JobDetail?jobId=22574&source=1111&tags=AO+2027_1111
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
Description :
Come and join an innovative and challenging team, where groundbreaking ideas shape the future of semiconductor technology. As an R&D Engineer, you will work on advanced technology development, such as exploratory research in advanced device architectures, device and process integration for manufacturability, advanced module process development, as well as the evaluation of novel materials, equipment, and processes.
Responsibilities:
1. Research & Pathfinding
(1) New material and new process pathfinding to enable new device architecture with integration.
(2) New tool pathfinding for new materials to enable the next nodes.
(3) Design, execute and analyze experiments to meet R&D engineering specifications.
(4) Process stability & manufacturability improvement for yield and reliability qualification.
(5) Process/tool transfer to development R&D or volume manufacturing (Fab).
(6) Highly motivated individuals with a strong technical background and teamwork skills.
2. Integration
For Device Engineers:
(1) Transistor Architecture & Design: Pioneering device design for advanced nodes.
(2) Advanced Characterization: Defining the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting bench electrical measurements (I-V, C-V).
(3) Simulation & Modeling: Utilizing TCAD (Technology Computer-Aided Design) and HSPICE to simulate device characteristics, optimize performance, and fortify model integrity.
(4) Test Key Design: Crafting precision test key designs to facilitate accurate electrical modeling, design rule validation, and comprehensive device characterization.
(5) Customer design enablement: Providing SPICE Model.
For Integration Engineers (or Process Integration Engineers) :
(1) Process Flow Integration: Integrating devices across various process modules (Lithography, Etch, Thin Films/Epi, Diffusion, CMP) to build a robust, manufacturable baseline for yield and device learning.
(2) Experimentation & Lot Handling: Designing advanced Experiments (DOE) to meet device KPIs. Periodically serving as the on-duty engineer to coordinate and handle device lots in the R&D fab.
(3) Yield & Reliability Learning: Conducting big data analysis (using JMP, Python, or custom iEDA tools) to identify process design weaknesses, hardware issues, or yield detractors.
(4) Technology Transfer: Transitioning the proven, optimized advanced integration baseline process from the R&D phase to fab for high-volume manufacturing.
3. Module R&D Engineer
(1) Pioneer Next-Generation Technologies: Research and develop advanced processes, novel materials, next-generation tooling, and cutting-edge computational/simulation methodologies for leading-edge semiconductor nodes.
(2) Drive High-Impact Innovation: Deliver highly manufacturable, stable, and cost-effective process technologies. Optimize device physics and performance to meet stringent yield, reliability, and qualification standards.
(3) Bridge Lab-to-Fab Scaling: Lead the technology transfer of advanced processes and hardware solutions from R&D phase to High-Volume Manufacturing (HVM) fabs, witnessing your research scale into global production.
4. R&D Process Center
(1) PE: Develop advanced module process, optimizing stability and manufacturability to ensure high yield and reliability. Transfer processes and tools to volume manufacturing while collaborating with cross-functional teams and external suppliers to drive leading-edge module integration. Additionally, manage day-to-day operations, troubleshoot equipment, and mentor technicians to sustain operational excellence.
(2) EE: Manage advanced semiconductor equipment (Diffusion, Thin Film, Lithography, or Etching) by performing warm-ups, troubleshooting, and efficiency enhancements. Plan and execute defect detection projects to analyze performance while collaborating closely with cross-functional engineers and vendors to ensure optimal equipment productivity and stability.
(3) MFG: Oversee daily IC foundry operations, managing work schedules, direct labor, and cross-functional collaboration (PE/PIE/EQ) to ensure consistent service delivery. Drive productivity, manage multiple projects with overlapping deadlines, and analyze data to keep operations running smoothly. Additionally, contribute to process improvements and maintain robotic/detection systems to meet customer and business objectives.
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